Title:
MULTILAYER SHEET, THERMALLY MOLDED CONTAINER, AND EASY-OPEN PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/148912
Kind Code:
A1
Abstract:
A multilayer sheet (20) that constitutes a thermally molded container for an easy-open packaging material has a surface layer (27) to which a lid material is to be molten and adhered, wherein the surface layer (27) comprises 30 to 70 mass% inclusive of a polypropylene resin, 10 to 30 mass% inclusive of a propylene-ethylene random copolymer having a melting point of 130°C or lower, and 20 to 40 mass% inclusive of a low-density polyethylene resin having a melting point of 120°C or higher. The multilayer sheet (20) also has a lowermost surface layer (26) which is arranged adjacent to the surface layer (27), wherein the lowermost surface layer (26) contains a polypropylene resin having an isotactic pentad fraction of 93 mol% or more as the main component.
Inventors:
SATO Toshiya (1660, Kamiizumi Sodegaura-sh, Chiba 05, 〒2990205, JP)
Application Number:
JP2011/061794
Publication Date:
December 01, 2011
Filing Date:
May 24, 2011
Export Citation:
Assignee:
IDEMITSU UNITECH CO., LTD. (26-2, Shinkawa 1-chome Chuo-k, Tokyo 33, 〒1040033, JP)
出光ユニテック株式会社 (〒33 東京都中央区新川一丁目２６番２号 Tokyo, 〒1040033, JP)
出光ユニテック株式会社 (〒33 東京都中央区新川一丁目２６番２号 Tokyo, 〒1040033, JP)
International Classes:
B32B27/32; B65D1/22; B65D65/40; B65D77/20
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (3rd floor, Ogikubo TM building 26-13, Ogikubo 5-chome, Suginami-k, Tokyo 51, 〒1670051, JP)
Claims: