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Title:
MULTILAYER SOFT MAGNETIC ALLOY THIN STRIP AND METHOD FOR PRODUCING SAME, AND LAMINATED CORE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/243697
Kind Code:
A1
Abstract:
The present invention provides a multilayer soft magnetic alloy thin strip which is obtained by staking a plurality of soft magnetic alloy thin strips having a thickness of 10 µm to 50 µm upon each other, wherein: a resin layer is arranged between the soft magnetic alloy thin strips; and the resin layer contains a resin that has a melting point Tm of 80°C to 170°C and a thermal decomposition initiation temperature of 360°C or more.

Inventors:
MORITSUGU NAKAO (JP)
INOUE MASAKI (JP)
ERA NAOYA (JP)
NOGUCHI SHIN (JP)
Application Number:
PCT/JP2023/022331
Publication Date:
December 21, 2023
Filing Date:
June 15, 2023
Export Citation:
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Assignee:
PROTERIAL LTD (JP)
International Classes:
H01F27/25; H01F41/02
Domestic Patent References:
WO2019087932A12019-05-09
Foreign References:
JP2007281314A2007-10-25
JP2008213410A2008-09-18
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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