Title:
MULTILAYER STRUCTURE, INTERPOSER AND METHOD FOR PRODUCING INTERPOSER
Document Type and Number:
WIPO Patent Application WO/2015/045469
Kind Code:
A1
Abstract:
A multilayer structure which comprises an anisotropic conductive member (2), first metal layers (4) that are arranged on both surfaces of the anisotropic conductive member (2), and second metal layers (5) that are arranged on the surfaces of the first metal layers (4). The anisotropic conductive member (2) is a metal filled structure having a plurality of conduction paths (7) which are formed by filling a plurality of micropores of an insulating base with a conductive material, said insulating base is formed of an anodic oxide film of an aluminum substrate. The constituent material of the first metal layers (4) contains at least one metal material selected from the group consisting of titanium, nickel, chromium and alloys of these metals. A metal material that constitutes the second metal layers (5) is different from the metal material that is contained in the first metal layers (4).
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Inventors:
YAMASHITA KOSUKE (JP)
Application Number:
PCT/JP2014/062255
Publication Date:
April 02, 2015
Filing Date:
May 07, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01R11/01; C25D11/18; H01B5/16; H01R43/00
Foreign References:
| JP2012089481A | 2012-05-10 | |||
| JPH04126307A | 1992-04-27 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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