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Patent Searching and Data


Title:
MULTILAYER STRUCTURE, AND PACKAGING MATERIAL FOR RETORT USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/184523
Kind Code:
A1
Abstract:
The present invention relates to: a multilayer structure at least having an outer layer and inner layer mainly containing a polypropylene resin, a barrier resin layer mainly containing an ethylene-vinyl alcohol copolymer, and a metal deposited layer mainly containing aluminum; a packaging material for a retort using the same; a method for recovering the multilayer structure; and a recovering composition including a recovery material of the multilayer structure. Provided are: a multilayer structure having excellent recyclability, appearance, gas barrier properties, and light shielding properties before and after retorting treatment; and a packaging material for a retort using the same.

Inventors:
YOSHIDA KENTARO (JP)
SUZUKI MAKOTO (JP)
Application Number:
PCT/JP2020/010086
Publication Date:
September 17, 2020
Filing Date:
March 09, 2020
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
B32B15/08; B29C55/12; C08J11/00
Domestic Patent References:
WO2015087976A12015-06-18
WO2017047103A12017-03-23
WO2020045629A12020-03-05
Foreign References:
JP2009079762A2009-04-16
JP2015183059A2015-10-22
JP2014126098A2014-07-07
JP2014129894A2014-07-10
JP2019135094A2019-08-15
Attorney, Agent or Firm:
SETOUCHI INTERNATIONAL PATENT FIRM (JP)
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