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Patent Searching and Data


Title:
MULTILAYER STRUCTURE FOR PACKAGING
Document Type and Number:
WIPO Patent Application WO/2004/101273
Kind Code:
A1
Abstract:
A multilayer structure which comprises at least an inner layer, an outer layer, and an interlayer. Important features thereof reside in that the interlayer has a sea-island structure which comprises a resin (A) constituting the sea part and a functional resin (B) constituting the island part and which gives an interlayer section in which the area of the sea part accounts for 80% or smaller, and that the inner and outer layers comprise a resin having adhesion to the resin (A). Thus, adhesion between the layers can be improved without disposing a special adhesive layer between the interlayer, which has functions such as gas-barrier properties, and each of the inner and outer layers. In addition, transparency also can be improved.

Inventors:
KITANO YOSHIHIRO (JP)
KIKUCHI ATSUSHI (JP)
YAMADA TOSHIKI (JP)
HANITA MISA (JP)
Application Number:
PCT/JP2004/006701
Publication Date:
November 25, 2004
Filing Date:
May 12, 2004
Export Citation:
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Assignee:
TOYO SEIKAN KAISHA LTD (JP)
KITANO YOSHIHIRO (JP)
KIKUCHI ATSUSHI (JP)
YAMADA TOSHIKI (JP)
HANITA MISA (JP)
International Classes:
B32B27/08; (IPC1-7): B32B27/00
Foreign References:
JP8025220B2
JP2001164002A2001-06-19
JP2002241608A2002-08-28
JPH02500846A1990-03-22
JPH03505843A1991-12-19
JP2001302918A2001-10-31
JP2003012944A2003-01-15
Other References:
See also references of EP 1629971A4
Attorney, Agent or Firm:
Ono, Hisazumi (Nishi-shimbashi 1-chome Minato-k, Tokyo 03, JP)
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