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Title:
MULTILAYER STRUCTURE AND PROCESS FOR PRODUCING MULTILAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2007/032493
Kind Code:
A1
Abstract:
A multilayer structure including a substrate and a thin film having pores which have been formed by patterning with a eversed-micelle mold formed in a solution and have been regulated with respect to shape, pore diameter, pore density, etc. Also provided is the multilayer structure in which the pores of the thin film have been filled with a functional substance. The former multilayer structure comprises: a thin film (A) comprising an organic polymer and an amphipathic substance and having pores (P); a substrate (B); and an interlayer (C) forming at least part of the interface between the thin film (A) and the substrate (B), wherein that side of the interlayer (C) which faces the thin layer (A) has a patterned hydrophobic part (S) formed from the substrate (B) and interlayer (C) or from the interlayer (C), the pores (P) in the thin film (A) have been patterned so that the pores localize in a thin-film part (Ap) facing the hydrophobic part (S), and the amphipathic substance is present on the periphery of the pores (P).

Inventors:
YAMADA, Yusuke (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 1008322, JP)
Application Number:
JP2006/318417
Publication Date:
March 22, 2007
Filing Date:
September 15, 2006
Export Citation:
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Assignee:
THE FURUKAWA ELECTRIC CO., LTD. (2-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 22, 1008322, JP)
古河電気工業株式会社 (〒22 東京都千代田区丸の内2丁目2番3号 Tokyo, 1008322, JP)
International Classes:
B32B3/24; B29C41/30; C08J9/28; B32B3/24; B29C41/00; C08J9/00
Attorney, Agent or Firm:
SATOH, Takahisa et al. (Sohshin International Patent Office, 4-2 Yanagibashi 2-chom, Taito-ku Tokyo 52, 1110052, JP)
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