Title:
MULTILAYER STRUCTURE AND TOUCH PANEL MODULE
Document Type and Number:
WIPO Patent Application WO/2015/125562
Kind Code:
A1
Abstract:
This multilayer structure comprises a laminate that is provided with: a transparent conductive member having a mesh-structured conductive pattern that is configured of a metal fine wire on a flexible transparent substrate; a protection member for protecting the transparent conductive member; and an optically transparent adhesive layer that is positioned between the transparent conductive member and the protection member. The laminate has a thickness of from 100 μm to 600 μm (inclusive). The thickness of the adhesive layer is 20% or more of the thickness of the laminate. The transparent conductive member has a thermal shrinkage of 0.5% or less at 150°C, and the difference between the thermal shrinkage of the transparent conductive member and the thermal shrinkage of the protection member at 150°C is 60% or less of the thermal shrinkage of the transparent conductive member at 150°C. This multilayer structure is utilized for a three-dimensionally shaped touch panel module.
Inventors:
KOIKE TAKASHI (JP)
KOBAYASHI HIROYUKI (JP)
NISHIDA TETSUJI (JP)
TSUBATA HISASHI (JP)
KOBAYASHI HIROYUKI (JP)
NISHIDA TETSUJI (JP)
TSUBATA HISASHI (JP)
Application Number:
PCT/JP2015/052059
Publication Date:
August 27, 2015
Filing Date:
January 26, 2015
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B15/02; G06F3/041
Foreign References:
| JP2015069508A | 2015-04-13 | |||
| JP2011018194A | 2011-01-27 | |||
| JP2003271065A | 2003-09-25 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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