Title:
MULTILAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/199986
Kind Code:
A1
Abstract:
This multilayer structure comprises a plurality of multilayer parts that are arranged on a base material; and each one of the multilayer parts comprises a resin layer, a glass layer that is superposed on the resin layer with an adhesive layer being interposed therebetween, and a metal layer that is formed on the adhesive layer-side surface of the glass layer. The thickness of the glass layer is from 10 μm to 300 μm; and the thickness of the resin layer is from 10 μm to 1,000 μm.
Inventors:
MURASHIGE TAKESHI (JP)
INAGAKI JUNICHI (JP)
SATO KEISUKE (JP)
KISHI ATSUSHI (JP)
INAGAKI JUNICHI (JP)
SATO KEISUKE (JP)
KISHI ATSUSHI (JP)
Application Number:
PCT/JP2021/009468
Publication Date:
October 07, 2021
Filing Date:
March 10, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B17/06; B32B3/00; C03C17/09; C03C27/10
Domestic Patent References:
| WO2009064462A1 | 2009-05-22 |
Foreign References:
| JP2012002894A | 2012-01-05 | |||
| JP2013231744A | 2013-11-14 | |||
| JP2019045858A | 2019-03-22 | |||
| JP2008209779A | 2008-09-11 | |||
| JP2013231744A | 2013-11-14 | |||
| JP2020059418A | 2020-04-16 |
Other References:
See also references of EP 4129648A4
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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