Title:
MULTILAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/190477
Kind Code:
A1
Abstract:
This multilayer structure has: a resin-made support body; a metal layer stacked on an upper surface side of the support body; a glass layer stacked on the metal layer; and a adhesive layer stacked on a lower surface of the support body, wherein the specific weight of the support body/the hardness of the adhesive layer is 20 or less.
Inventors:
SATO KEISUKE (JP)
INAGAKI JUNICHI (JP)
WATANABE RYO (JP)
INAGAKI JUNICHI (JP)
WATANABE RYO (JP)
Application Number:
PCT/JP2023/012437
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
G02B5/08; B32B15/08; B32B17/06; B32B27/00
Domestic Patent References:
| WO2011122241A1 | 2011-10-06 | |||
| WO2013141304A1 | 2013-09-26 | |||
| WO2016009745A1 | 2016-01-21 | |||
| WO2017018393A1 | 2017-02-02 |
Foreign References:
| JP2016017995A | 2016-02-01 | |||
| JP2011128501A | 2011-06-30 | |||
| JP2011203553A | 2011-10-13 | |||
| JP2016086026A | 2016-05-19 | |||
| JP2016043560A | 2016-04-04 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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