Title:
MULTILAYER SUBSTRATE AND ELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2019/159521
Kind Code:
A1
Abstract:
A multilayer substrate (101) is provided with: a laminated body (10) that is formed by laminating a plurality of insulating base layers (11, 12, 13); and a plurality of conductor patterns (signal conductor (31, 32), ground conductor (41, 42, 43), etc.) that are formed on the insulating base layers (11, 12, 13). The laminated body (10) has a first surface (S1), and the plurality of conductor patterns include mounting electrodes (EP11, EP12, EP21). The mounting electrode (EP11) has a first opening (H11), and the mounting electrode (EP12) has a first opening (H12). The first openings (H11, H12) are formed so as to span mounting areas (M11, M12) that overlap a mounted component and non-mounting areas (NM11, NM12) that do not overlap the mounted component when the mounted component is mounted on a mounting electrode from among the mounting electrodes (EP11, EP12) in plan view of a mounting surface (viewed from the Z-axis direction).
Inventors:
SATO TAKAKO (JP)
Application Number:
PCT/JP2018/046079
Publication Date:
August 22, 2019
Filing Date:
December 14, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/34; H05K1/02; H05K3/46; H01B7/08
Foreign References:
| JP2000165042A | 2000-06-16 | |||
| JPS62126866U | 1987-08-12 | |||
| JP2001144448A | 2001-05-25 | |||
| JP2006179809A | 2006-07-06 | |||
| JPS5788968U | 1982-06-01 | |||
| JP2011243853A | 2011-12-01 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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