Title:
MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/025696
Kind Code:
A1
Abstract:
This multilayer substrate (10) is provided with a laminate (20), coil conductor patterns (31, 32) and a connection conductor pattern (33). The laminate (20) is obtained by laminating a plurality of insulator layers (21, 22, 23). The coil conductor pattern (31) is formed on the surface of the insulator layer (21), and has a winding form having an outer end part (311) and an inner end part (312). The coil conductor pattern (32) is formed on the surface of the insulator layer (21), and has end parts (321, 322). The connection conductor pattern (33) is formed in the laminate (20), and connects the coil conductor patterns (31, 32) to each other. The outer end part (311) of the coil conductor pattern (31) is connected to a terminal conductor (41) on the back surface of the laminate (20). The end part (322) of the coil conductor pattern (32) is connected to a terminal conductor (42) on the back surface of the laminate (20). The coil conductor pattern (32) runs along the outer periphery of the coil conductor pattern (31).
Inventors:
ITO SHINGO (JP)
FUJII HIROTAKA (JP)
FUJII HIROTAKA (JP)
Application Number:
PCT/JP2017/026759
Publication Date:
February 08, 2018
Filing Date:
July 25, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H01F17/00; H05K1/16
Domestic Patent References:
| WO2014129279A1 | 2014-08-28 | |||
| WO2008016089A1 | 2008-02-07 |
Foreign References:
| JP2011155299A | 2011-08-11 | |||
| JPS5691406A | 1981-07-24 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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