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Title:
MULTILAYER SUBSTRATE, FILTER, MULTIPLEXER, HIGH-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/160140
Kind Code:
A1
Abstract:
Provided are a multilayer substrate, filter, multiplexer, high-frequency front-end circuit, and communication device with which it is possible to suppress the occurrence of stray capacitance. A multilayer substrate (1), comprising a dielectric substrate (2), a pair of capacitor electrodes (3, 4), and an input/output electrode (6) for input, output, or input and output. The dielectric substrate (2) has a first main surface and a second main surface (22) located on mutually opposite sides in the thickness direction (D1) of the dielectric substrate (2). The pair of capacitor electrodes (3, 4) are provided on the dielectric substrate (2). The pair of capacitor electrodes (3, 4) face each other in the thickness direction (D1). The input/output electrode (6) is disposed on the second main surface (22) of the dielectric substrate (2). At least a part of a capacitor (5) formed by the pair of capacitor electrodes (3, 4) and a portion (25) of the dielectric substrate (2) interposed between the pair of capacitor electrodes (3, 4) overlaps with the input/output electrode (6) electrically connected to the capacitor (5).

Inventors:
HISANO TAIZO
TSUKAMOTO HIDEKI
Application Number:
PCT/JP2019/005868
Publication Date:
August 22, 2019
Filing Date:
February 18, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/46; H05K1/16
Domestic Patent References:
WO2016136295A12016-09-01
WO2017094574A12017-06-08
WO2001069710A12001-09-20
Foreign References:
JP2005176341A2005-06-30
JP2007318657A2007-12-06
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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