Title:
MULTILAYER SUBSTRATE AND IMAGING ELEMENT UNIT
Document Type and Number:
WIPO Patent Application WO/2022/044856
Kind Code:
A1
Abstract:
The purpose of the present invention is to block light that is transmitted through a substrate on which an imaging element is mounted, and incident on the imaging element. A multilayer substrate (102) on which an imaging element (101) is mounted and which has a plurality of conductor layers comprises: a plurality of vias (drill via (300) and small-diameter via (301)) which are stacked and connected in a straight line; and a light-blocking part which blocks light transmitted through unwired regions (302) that provide isolation between the vias and other wires and traveling to the imaging element (101). The light-blocking part is a land (300a) of the via, the land being formed, in at least one conductor layer, in a range wider than the unwired regions (302) of the other conductor layers.
Inventors:
TODA DAISUKE (JP)
Application Number:
PCT/JP2021/029834
Publication Date:
March 03, 2022
Filing Date:
August 13, 2021
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
G03B17/02; H04N5/225; H05K3/28; H05K3/46
Foreign References:
| JP2012037689A | 2012-02-23 | |||
| JP2002280737A | 2002-09-27 | |||
| JP2019062092A | 2019-04-18 | |||
| JP2016046270A | 2016-04-04 |
Attorney, Agent or Firm:
TAKAOKA, Ryoichi et al. (JP)
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