Title:
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2015/083222
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a multilayer substrate which can accommodate next-generation high-speed transmission methods, and is thinner than at present in order to conserve space regardless of whether a flexible circuit board or rigid circuit board is used. This multilayer substrate, in which a conducting layer and an insulating layer are alternately stacked, has a multilayer structure in which a thermoplastic resin as an insulating layer and a thermosetting dielectric resin are alternately sequentially stacked.
Inventors:
FUKUSHIMA YOSHIHIRO (JP)
KAMOTO KOJI (JP)
YAMADA SHOICHI (JP)
KAMOTO KOJI (JP)
YAMADA SHOICHI (JP)
Application Number:
PCT/JP2013/082387
Publication Date:
June 11, 2015
Filing Date:
December 02, 2013
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
H05K3/46
Foreign References:
| JPH08181450A | 1996-07-12 | |||
| JP2005236196A | 2005-09-02 |
Attorney, Agent or Firm:
TANI & ABE, p. c. (JP)
Patent business corporation A valley and Abe patent firm (JP)
Patent business corporation A valley and Abe patent firm (JP)
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