Title:
MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/209978
Kind Code:
A1
Abstract:
Provided is a multilayer substrate manufacturing method such that it is possible to inhibit between-bump short-circuiting and substrate warping. This multilayer substrate manufacturing method includes: a step for preparing a first substrate which is a rigid substrate comprising a plurality of first bumps on the surface thereof at specified dispositions, and a second substrate or a semiconductor device comprising a plurality of second bumps on the surface thereof at corresponding dispositions, said step being such that the first bumps and the second bumps are composed of a metal or an alloy having a melting point of 600°C or greater, and the first bumps and the second bumps have a height of 0.3 μm or greater; and a step for carrying out cleaning processing of bonding surfaces of the first bumps and bonding surfaces of the second bumps in an atmosphere having a pressure of 1×10-3 Pa or less, stacking the first substrate and the second substrate or the semiconductor device such that the bonding surfaces of the first bumps and the bonding surfaces of the second bumps are continuously abutting, pressure welding the first bumps and the second bumps at a temperature of 90°C or less, and forming a multilayer substrate.
Inventors:
KITABATAKE YUKIKO (JP)
KOMIYA MIKIKO (JP)
MATSUURA YOSHINORI (JP)
KOMIYA MIKIKO (JP)
MATSUURA YOSHINORI (JP)
Application Number:
PCT/JP2022/012390
Publication Date:
October 06, 2022
Filing Date:
March 17, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H01L23/12; H01L21/60; H01L23/14; H01L23/15; H05K1/14; H05K3/36; H05K3/46
Domestic Patent References:
| WO2017150283A1 | 2017-09-08 | |||
| WO2017150284A1 | 2017-09-08 |
Foreign References:
| JP2006080100A | 2006-03-23 | |||
| JP2017028156A | 2017-02-02 | |||
| JP2014113633A | 2014-06-26 | |||
| JP2014093339A | 2014-05-19 | |||
| JP2014150235A | 2014-08-21 | |||
| JP2015111618A | 2015-06-18 | |||
| JP2005101137A | 2005-04-14 | |||
| JP2015035551A | 2015-02-19 | |||
| JP5159273B2 | 2013-03-06 | |||
| JP5699891B2 | 2015-04-15 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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