MULTILAYER SUBSTRATE MANUFACTURING METHOD AND MULTILAYER SUBSTRATE

WIPO Patent Application WO/2021/025073

A1

This multilayer substrate manufacturing method is for manufacturing this multilayer substrate that includes first insulative resin base material layers (1A, 1B, 1C) and second insulative resin base material layers (2A, 2B) formed from different materials from each other. A conductor film-equipped insulative resin base material formation step includes: a first step for forming a conductor film on the first insulative resin base material layers (1A, 1B, 1C) so as to configure a conductor film-equipped insulative resin base material; or a second step for, in a laminated body including at least the first insulative resin base material layers (1A, 1B, 1C), forming conductor films on main surfaces of the first insulative resin base material layers (1A, 1B, 1C) having the main surfaces of the laminated body so as to configure a second conductor film-equipped insulative resin base material. In a lamination step, a first conductor film-equipped insulative resin base material or the second conductor film-equipped insulative resin base material is laminated with another base material layer such that the conductor film is in contact with the second insulative resin base material layers (2A, 2B). The adhesiveness of the first insulative resin base material layers (1A, 1B, 1C) with respect to a conductor film is higher than the adhesiveness of the second insulative resin base material layers (2A, 2B) with respect to a conductor film.

KAMITSUBO YUSUKE (JP)
FURUMURA TOMOHIRO (JP)

PCT/JP2020/030062

February 11, 2021

August 05, 2020

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MURATA MANUFACTURING CO (JP)

H01L23/12; H05K3/22; H05K3/46

WO2018211992A1

2018-11-22

JP2006344828A

2006-12-21

KAEDE PATENT ATTORNEYS' OFFICE (JP)

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