MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2010/067508

A1

Disclosed is a multilayer substrate having a lower height, an improved function, and a higher degree of freedom in design.  Also disclosed is a method for manufacturing the multilayer substrate.  Specifically disclosed are a multilayer substrate (11) comprising a core substrate (2) and a first resin layer (12) formed on one major surface (3) of the core substrate (2), and a method for manufacturing the multilayer substrate (11).  A first component (10) is mounted on a surface conductor (15) which is formed on a major surface (3) of the first resin layer (12), said major surface (3) being in contact with the core substrate (2).  A second component (20) is mounted on a surface conductor (35a) which is formed on a major surface (23) of the first resin layer (12), said major surface (23) being on the reverse side of the major surface (3) that is in contact with the core substrate (2).  Consequently, the mounted first component (10) and the mounted second component (20) are embedded in the first resin layer (12), thereby producing the multilayer substrate (11).

MORIKITA, Yutaka (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
森木田豊 (〒55 京都府長岡京市東神足１丁目１０番１号株式会社村田製作所内 Kyoto, 〒6178555, JP)

JP2009/005897

June 17, 2010

November 06, 2009

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MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
MORIKITA, Yutaka (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)

H05K3/46

YANASE, Yuji et al. (4F TAKAGI BLDG, 1-19 Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)

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