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Patent Searching and Data


Title:
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/221647
Kind Code:
A1
Abstract:
A multilayer substrate (101) is provided with: a laminated body (10) formed by laminating a plurality of insulating base layers (11, 12, 13, 14, 15); and conductor patterns (31, 32, 33) formed on the insulating base layers (12, 14) (conductor formation base layer). The insulating base layer (13) (thickness adjustment base layer) is configured from a frame part (1), an opening part (2) formed on the inside of the frame part, an island-form part (3) disposed on the inside of the frame part (3), and a plurality of connecting parts (4) that connect the island-form part (3) to the frame part (1). The conductor patterns (31, 32) encircle the island-form part (3) when seen from the laminating direction (Z axis direction) of the plurality of insulating base layers (11, 12, 13, 14, 15). The line width of the connecting part (4) is less than the width of the island-form part (3), and the island-form part (3) is connected to the frame part via the plurality of connecting parts (4). With the opening part (2), when seen from the Z axis direction, the surface area that overlaps the conductor patterns (31, 32) is greater than that of the frame part (1) and the island-form part (3).

Inventors:
ITO SHINGO (JP)
GOUCHI NAOKI (JP)
FUJII HIROTAKA (JP)
MURAOKA KAZUTAKA (JP)
Application Number:
JP2017/020190
Publication Date:
December 28, 2017
Filing Date:
May 31, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H01F17/00; H01F41/04; H05K1/16
Foreign References:
JP2012099600A2012-05-24
JP2012070243A2012-04-05
JP2008166385A2008-07-17
JPH06251971A1994-09-09
JP2013145836A2013-07-25
JP2005209816A2005-08-04
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
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