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Patent Searching and Data


Title:
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/199826
Kind Code:
A1
Abstract:
The present invention addresses the problem of suppressing a positional deviation of an internal conductor pattern in a multilayer substrate in which resin layers made of thermoplastic resin are stacked. A multilayer substrate (10) includes a laminate (20), a conductor pattern (32), a through-hole (42) for eliminating height differences, and a thickness adjusting member (51). The laminate (20) is formed by stacking a plurality of resin layers (21-23) each made of thermoplastic resin. The conductor pattern (32) is formed on a main face of the resin layer (22) and is disposed within the laminate (20). The through-hole (42) for eliminating height differences is located at a position different from the position of the conductor pattern (32) when the laminate (20) is viewed in plan and penetrates the resin layer (22) in the thickness direction. The thickness adjusting member (51) is made of the same material as the resin layers (21-23), is disposed inside the through-hole (42), and has a thickness exceeding the thickness of the resin layer (22).

Inventors:
YOSUI KUNIAKI (JP)
Application Number:
JP2017/017775
Publication Date:
November 23, 2017
Filing Date:
May 11, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H01F17/00; H01F41/04
Domestic Patent References:
WO2015129601A12015-09-03
Foreign References:
JPH04321295A1992-11-11
JP2012099600A2012-05-24
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
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