Title:
MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE MODULE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270294
Kind Code:
A1
Abstract:
The present invention is a multilayer substrate. A second signal conductor layer is positioned in a second direction as compared to a first signal conductor layer, and includes an overlap part that overlaps with the first signal conductor layer as viewed in the vertical direction. An interlayer connection conductor overlaps with the overlap part as viewed in the vertical direction, and is in contact with the first and second signal conductor layers. A first reference conductor layer is positioned in the second direction as compared to the second signal conductor layer, and overlaps with at least a portion of the overlap part as viewed in the vertical direction. A first cavity overlaps with at least a portion of the interlayer connection conductor as viewed in the vertical direction, and is positioned between the second signal conductor layer and the first reference conductor layer in the vertical direction.
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Inventors:
ICHIKAWA KEIICHI (JP)
NISHIO KOSUKE (JP)
NISHIO KOSUKE (JP)
Application Number:
PCT/JP2022/022909
Publication Date:
December 29, 2022
Filing Date:
June 07, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/14; H05K1/02; H05K3/46
Domestic Patent References:
| WO2019131286A1 | 2019-07-04 | |||
| WO2017110389A1 | 2017-06-29 |
Foreign References:
| JPH04116892A | 1992-04-17 | |||
| JPH04221890A | 1992-08-12 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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