Title:
MULTILAYER SUBSTRATE MODULE
Document Type and Number:
WIPO Patent Application WO/2021/225055
Kind Code:
A1
Abstract:
A first substrate portion comprises a first substrate portion body having a structure in which a plurality of first insulator layers are stacked in an up-down direction, and a first conductor layer and a first interlayer connection conductor which are provided in the first substrate portion body. A second substrate portion comprises a second substrate portion body having a structure in which a plurality of second insulator layers are stacked in the up-down direction, and a second conductor layer and a second interlayer connection conductor which are provided in the second substrate portion body. The second substrate portion is provided on an upper surface of the first substrate portion. A mounted component is mounted on an upper surface or a lower surface of the second substrate portion. At least a part of an inductive component is formed by the first conductor layer and the first interlayer connection conductor. A capacitive component is formed by the second conductor layer and/or the second interlayer connection conductor. The material of the plurality of second insulator layers has a Young's modulus greater than the Young's modulus of the material of the plurality of first insulator layers.
Inventors:
OKUDA NORIAKI (JP)
NAGAI TOMOHIRO (JP)
NISHIO KOSUKE (JP)
NAGAI TOMOHIRO (JP)
NISHIO KOSUKE (JP)
Application Number:
PCT/JP2021/014798
Publication Date:
November 11, 2021
Filing Date:
April 07, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P1/213; H01Q13/08; H03H7/01; H05K1/02; H05K3/46
Domestic Patent References:
| WO2015033704A1 | 2015-03-12 | |||
| WO2014185194A1 | 2014-11-20 |
Foreign References:
| JP2006237231A | 2006-09-07 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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