Title:
MULTILAYER SUBSTRATE AND TRANSMISSION LINE DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131286
Kind Code:
A1
Abstract:
This transmission line device (301) is provided with: a first multilayer substrate (101) that comprises a transmission line which is configured to contain a plurality of insulating base materials stacked together and conductor patterns that are formed on the insulating base materials; and a second multilayer substrate (201) that serves as a connection member to which the transmission line of the first multilayer substrate is connected. The conductor patterns include a signal conductor pattern (SL1) and a signal electrode pad (P1) which is electrically connected to the signal conductor pattern (SL1). The first multilayer substrate (101) is provided with a resist film (RF) which is formed on the surface of the stack of the insulating base materials; and the resist film (RF) has an aperture (AP1) which is at a distance from the outer edge of the signal electrode pad (P1) in the plane direction of the stack of the insulating base materials, and from which the signal electrode pad (P1) is exposed.
Inventors:
YOSUI KUNIAKI (JP)
Application Number:
PCT/JP2018/046404
Publication Date:
July 04, 2019
Filing Date:
December 17, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/14; H05K1/02; H05K3/46; H05K3/34
Domestic Patent References:
| WO2016088592A1 | 2016-06-09 | |||
| WO2014069061A1 | 2014-05-08 |
Foreign References:
| US7405477B1 | 2008-07-29 | |||
| JP2014082455A | 2014-05-08 | |||
| JPH08236894A | 1996-09-13 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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