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Patent Searching and Data


Title:
MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/025490
Kind Code:
A1
Abstract:
The present invention is provided with: a first metal plate that forms a first coil; a second metal plate, which faces the first metal plate in the coil winding axis direction, and which forms a second coil; a first insulating layer incorporating the first metal plate; and a second insulating layer incorporating the second metal plate. A metal foil is connected to the first metal plate via a plurality of via holes, and an electronic component incorporated in the first insulating layer is mounted on a pattern formed as a part of the metal foil.

Inventors:
MOISEEV Sergey (2-1 Toyoda-cho, Kariya-sh, Aichi 71, 〒4488671, JP)
KAWABE Masahiko (2-1 Toyoda-cho, Kariya-sh, Aichi 71, 〒4488671, JP)
IWATA Yoshitaka (2-1 Toyoda-cho, Kariya-sh, Aichi 71, 〒4488671, JP)
Application Number:
JP2017/020794
Publication Date:
February 08, 2018
Filing Date:
June 05, 2017
Export Citation:
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Assignee:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (2-1 Toyoda-cho, kariya-shi Aichi, 71, 〒4488671, JP)
International Classes:
H05K1/16; H01F5/00; H01F27/28; H05K3/46
Domestic Patent References:
WO2011145490A12011-11-24
Foreign References:
JP2015088689A2015-05-07
JP2008270532A2008-11-06
Attorney, Agent or Firm:
ITO Masaki (Inc. 4-15, Hirokoji, Kariya-sh, Aichi 44, 〒4480844, JP)
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