Title:
MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/037852
Kind Code:
A1
Abstract:
A first interlayer connection conductor penetrates through resin layers in a lamination direction, and electrically connects a first signal conductor and a second signal conductor. A second interlayer connection conductor penetrates through the resin layers in the lamination direction, and electrically connects the first signal conductor and the second signal conductor. A plurality of first interlayer connection conductors are lined up, as seen from the lamination direction, in a first line extending along the first signal conductor. A plurality of second interlayer connection conductors are lined up, as seen from the lamination direction, in a second line extending along the first signal conductor. As seen from the lamination direction, a direction, which is orthogonal to a direction in which the first signal conductor extends, is a line width direction. The position in the line width direction of the second line is different from that in the line width direction of the first line.
Inventors:
TERANISHI KEISUKE (JP)
FUJII HIROTAKA (JP)
FUJII HIROTAKA (JP)
Application Number:
PCT/JP2022/031488
Publication Date:
March 16, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H01P3/00
Foreign References:
| JP2013126029A | 2013-06-24 | |||
| JP2000059113A | 2000-02-25 | |||
| JPH044405U | 1992-01-16 | |||
| EP2244331A1 | 2010-10-27 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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