CROSS-REFERENCE TO RELATED APPLICATION

[0001] The application claims priority of EP application 19182977.9 which was filed on June 27, 2019 and which is incorporated herein in its entirety by reference.

FIELD

[0002] The present invention relates to a multilayer superconductive article such as a tape, a superconductive coil, an actuator, a motor, a stage apparatus and a lithographic apparatus.

BACKGROUND

[0003] A lithographic apparatus is a machine constructed to apply a desired pattern onto a substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may, for example, project a pattern (also often referred to as“design layout” or “design”) of a patterning device (e.g., a mask) onto a layer of radiation-sensitive material (resist) provided on a substrate (e.g., a wafer).

[0004] As semiconductor manufacturing processes continue to advance, the dimensions of circuit elements have continually been reduced while the amount of functional elements, such as transistors, per device has been steadily increasing over decades, following a trend commonly referred to as‘Moore’s law’. To keep up with Moore’s law the semiconductor industry is chasing technologies that enable to create increasingly smaller features. To project a pattern on a substrate a lithographic apparatus may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of features which are patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm and 13.5 nm. A lithographic apparatus, which uses extreme ultraviolet (EUV) radiation, having a wavelength within a range of 4 nm to 20 nm, for example 6.7 nm or 13.5 nm, may be used to form smaller features on a substrate than a lithographic apparatus which uses, for example, radiation with a wavelength of 193 nm.

[0005] To project the desired pattern onto the substrate, a patterning device is typically displaced relative to a radiation beam, so as to generate a patterned radiation beam. At the same time, the substrate is displaced relative to the patterned radiation beam, so as to receive the pattern onto a radiation-sensitive material on the substrate. In order to realise the required displacements, the patterning device and the substrate are typically mounted onto object tables, which are typically displaced and positioned by means of a plurality of actuators and motors such as electromagnetic actuators and electromagnetic motors. In order to improve the performance of a lithographic apparatus, in particular the throughput of the apparatus, there is a continuous need for more powerful motors and actuators for the displacement and positioning of the patterning device and substrate. In order to meet this need, superconductive motors can be considered. In order to maintain such motors in a superconductive state, the superconductive coils as applied in such motors, need to be maintained below a critical temperature. In order to do so, any losses occurring in said coils need to be vacated effectively. It would be desirable to improve the cooling capabilities of known superconductive coils or motors.

SUMMARY

[0006] In order to improve the cooling capabilities of known superconductive coils or motors, there is provided, according to a first aspect of the invention, a multilayer superconductive article extending in a longitudinal direction comprising:

a substrate layer extending in the longitudinal direction;

a superconductive layer extending in the longitudinal direction;

a further layer extending in the longitudinal direction;

wherein the substrate layer or the further layer comprises one or more cooling tabs extending in the longitudinal direction and in a transverse direction.

[0007] According to a second aspect of the present invention, there is provided a superconductive coil comprising a plurality of windings made from a superconductive tape, the superconductive coil further comprises one or more inserts arranged in a space between adjacent windings of the plurality of windings, the one or more inserts having a width that is larger than a width of the superconductive tape.

[0008] According to yet another aspect of the present invention, there is provided an actuator or motor comprising a superconductive coil according to the present invention.

[0009] According to yet another aspect of the present invention, there is provided a stage apparatus comprising an actuator or motor according to the present invention.

[00010] According to yet another aspect of the present invention, there is provided a lithographic apparatus comprising a stage apparatus according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[00011] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings, in which:

Figure 1 depicts a schematic overview of a lithographic apparatus;

Figure 2 depicts a detailed view of a part of the lithographic apparatus of Figure 1 ;

Figure 3 schematically depicts a position control system; Figure 4 schematically depicts a plan view of a superconductive tape as known in the art;

Figure 5 schematically depicts a cross-sectional view of a superconductive coil as known in the art;

Figure 6 schematically depicts a plan view of a superconductive tape according to an embodiment of the invention;

Figures 7 and 8 schematically depict cross-sectional views of superconductive articles according to embodiments of the invention;

Figures 9 to 12 schematically depict cross-sectional views of superconductive coils according to embodiments of the invention;

Figures 13 to 16 schematically depict plan views of superconductive coils according to embodiments of the invention;

Figures 17 to 21 schematically depict plan views of mounting arrangements of coils according to the present invention.

Figure 22 schematically depicts a cross-sectional view of a superconductive article according to an embodiment of the invention.

DETAILED DESCRIPTION

In the present document, the terms“radiation” and“beam” are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g. with a wavelength of 365, 248, 193, 157 or 126 nm) and EUV (extreme ultra-violet radiation, e.g. having a wavelength in the range of about 5-100 nm).

The term“reticle”,“mask” or“patterning device” as employed in this text may be broadly interpreted as referring to a generic patterning device that can be used to endow an incoming radiation beam with a patterned cross-section, corresponding to a pattern that is to be created in a target portion of the substrate. The term“light valve” can also be used in this context. Besides the classic mask (transmissive or reflective, binary, phase-shifting, hybrid, etc.), examples of other such patterning devices include a programmable mirror array and a programmable LCD array.

[00012] Figure 1 schematically depicts a lithographic apparatus LA. The lithographic apparatus LA includes an illumination system (also referred to as illuminator) IL configured to condition a radiation beam B (e.g., UV radiation, DUV radiation or EUV radiation), a mask support (e.g., a mask table) MT constructed to support a patterning device (e.g., a mask) MA and connected to a first positioner PM configured to accurately position the patterning device MA in accordance with certain parameters, a substrate support (e.g., a wafer table) WT constructed to hold a substrate (e.g., a resist coated wafer) W and connected to a second positioner PW configured to accurately position the substrate support in accordance with certain parameters, and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g., comprising one or more dies) of the substrate W.

[00013] In operation, the illumination system IL receives a radiation beam from a radiation source SO, e.g. via a beam delivery system BD. The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and/or other types of optical components, or any combination thereof, for directing, shaping, and/or controlling radiation. The illuminator IL may be used to condition the radiation beam B to have a desired spatial and angular intensity distribution in its cross section at a plane of the patterning device MA.

[00014] The term“projection system” PS used herein should be broadly interpreted as encompassing various types of projection system, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic and/or electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, and/or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term“projection lens” herein may be considered as synonymous with the more general term“projection system” PS.

[00015] The lithographic apparatus LA may be of a type wherein at least a portion of the substrate may be covered by a liquid having a relatively high refractive index, e.g., water, so as to fill a space between the projection system PS and the substrate W - which is also referred to as immersion lithography. More information on immersion techniques is given in US6952253, which is incorporated herein by reference.

[00016] The lithographic apparatus LA may also be of a type having two or more substrate supports WT (also named“dual stage”). In such“multiple stage” machine, the substrate supports WT may be used in parallel, and/or steps in preparation of a subsequent exposure of the substrate W may be carried out on the substrate W located on one of the substrate support WT while another substrate W on the other substrate support WT is being used for exposing a pattern on the other substrate W.

[00017] In addition to the substrate support WT, the lithographic apparatus LA may comprise a measurement stage. The measurement stage is arranged to hold a sensor and/or a cleaning device. The sensor may be arranged to measure a property of the projection system PS or a property of the radiation beam B. The measurement stage may hold multiple sensors. The cleaning device may be arranged to clean part of the lithographic apparatus, for example a part of the projection system PS or a part of a system that provides the immersion liquid. The measurement stage may move beneath the projection system PS when the substrate support WT is away from the projection system PS.

[00018] In operation, the radiation beam B is incident on the patterning device, e.g. mask, MA which is held on the mask support MT, and is patterned by the pattern (design layout) present on patterning device MA. Having traversed the patterning device MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of the second positioner PW and a position measurement system IF, the substrate support WT can be moved accurately, e.g., so as to position different target portions C in the path of the radiation beam B at a focused and aligned position. Similarly, the first positioner PM and possibly another position sensor (which is not explicitly depicted in Figure 1) may be used to accurately position the patterning device MA with respect to the path of the radiation beam B. Patterning device MA and substrate W may be aligned using mask alignment marks Ml, M2 and substrate alignment marks PI, P2. Although the substrate alignment marks PI, P2 as illustrated occupy dedicated target portions, they may be located in spaces between target portions. Substrate alignment marks PI, P2 are known as scribe-lane alignment marks when these are located between the target portions C.

[00019] To clarify the invention, a Cartesian coordinate system is used. The Cartesian coordinate system has three axis, i.e., an x-axis, a y-axis and a z-axis. Each of the three axis is orthogonal to the other two axis. A rotation around the x-axis is referred to as an Rx-rotation. A rotation around the y-axis is referred to as an Ry-rotation. A rotation around about the z-axis is referred to as an Rz -rotation. The x- axis and the y-axis define a horizontal plane, whereas the z-axis is in a vertical direction. The Cartesian coordinate system is not limiting the invention and is used for clarification only. Instead, another coordinate system, such as a cylindrical coordinate system, may be used to clarify the invention. The orientation of the Cartesian coordinate system may be different, for example, such that the z-axis has a component along the horizontal plane.

[00020] Figure 2 shows a more detailed view of a part of the lithographic apparatus LA of Figure 1. The lithographic apparatus LA may be provided with a base frame BF, a balance mass BM, a metrology frame MF and a vibration isolation system IS. The metrology frame MF supports the projection system PS. Additionally, the metrology frame MF may support a part of the position measurement system PMS. The metrology frame MF is supported by the base frame BF via the vibration isolation system IS. The vibration isolation system IS is arranged to prevent or reduce vibrations from propagating from the base frame BF to the metrology frame MF.

[00021] The second positioner PW is arranged to accelerate the substrate support WT by providing a driving force between the substrate support WT and the balance mass BM. The driving force accelerates the substrate support WT in a desired direction. Due to the conservation of momentum, the driving force is also applied to the balance mass BM with equal magnitude, but at a direction opposite to the desired direction. Typically, the mass of the balance mass BM is significantly larger than the masses of the moving part of the second positioner PW and the substrate support WT. [00022] In an embodiment, the second positioner PW is supported by the balance mass BM. For example, wherein the second positioner PW comprises a planar motor to levitate the substrate support WT above the balance mass BM. In another embodiment, the second positioner PW is supported by the base frame BF. For example, wherein the second positioner PW comprises a linear motor and wherein the second positioner PW comprises a bearing, like a gas bearing, to levitate the substrate support WT above the base frame BF.

[00023] The position measurement system PMS may comprise any type of sensor that is suitable to determine a position of the substrate support WT. The position measurement system PMS may comprise any type of sensor that is suitable to determine a position of the mask support MT. The sensor may be an optical sensor such as an interferometer or an encoder. The position measurement system PMS may comprise a combined system of an interferometer and an encoder. The sensor may be another type of sensor, such as a magnetic sensor a capacitive sensor or an inductive sensor. The position measurement system PMS may determine the position relative to a reference, for example the metrology frame MF or the projection system PS. The position measurement system PMS may determine the position of the substrate table WT and/or the mask support MT by measuring the position or by measuring a time derivative of the position, such as velocity or acceleration.

[00024] The position measurement system PMS may comprise an encoder system. An encoder system is known from for example, United States patent application US2007/0058173A1, filed on September 7, 2006, hereby incorporated by reference. The encoder system comprises an encoder head, a grating and a sensor. The encoder system may receive a primary radiation beam and a secondary radiation beam. Both the primary radiation beam as well as the secondary radiation beam originate from the same radiation beam, i.e., the original radiation beam. At least one of the primary radiation beam and the secondary radiation beam is created by diffracting the original radiation beam with the grating. If both the primary radiation beam and the secondary radiation beam are created by diffracting the original radiation beam with the grating, the primary radiation beam needs to have a different diffraction order than the secondary radiation beam. Different diffraction orders are, for example, +l ^st order, -1 ^st order, +2 ^nd order and -2 ^nd order. The encoder system optically combines the primary radiation beam and the secondary radiation beam into a combined radiation beam. A sensor in the encoder head determines a phase or phase difference of the combined radiation beam. The sensor generates a signal based on the phase or phase difference. The signal is representative of a position of the encoder head relative to the grating. One of the encoder head and the grating may be arranged on the substrate structure WT. The other of the encoder head and the grating may be arranged on the metrology frame MF or the base frame BF. For example, a plurality of encoder heads are arranged on the metrology frame MF, whereas a grating is arranged on a top surface of the substrate support WT. In another example, a grating is arranged on a bottom surface of the substrate support WT, and an encoder head is arranged below the substrate support WT.

[00025] The position measurement system PMS may comprise an interferometer system. An interferometer system is known from, for example, United States patent US6,020,964, filed on July 13, 1998, hereby incorporated by reference. The interferometer system may comprise a beam splitter, a mirror, a reference mirror and a sensor. A beam of radiation is split by the beam splitter into a reference beam and a measurement beam. The measurement beam propagates to the mirror and is reflected by the mirror back to the beam splitter. The reference beam propagates to the reference mirror and is reflected by the reference mirror back to the beam splitter. At the beam splitter, the measurement beam and the reference beam are combined into a combined radiation beam. The combined radiation beam is incident on the sensor. The sensor determines a phase or a frequency of the combined radiation beam. The sensor generates a signal based on the phase or the frequency. The signal is representative of a displacement of the mirror. In an embodiment, the mirror is connected to the substrate support WT. The reference mirror may be connected to the metrology frame MF. In an embodiment, the measurement beam and the reference beam are combined into a combined radiation beam by an additional optical component instead of the beam splitter.

[00026] The first positioner PM may comprise a long-stroke module and a short-stroke module. The short-stroke module is arranged to move the mask support MT relative to the long-stroke module with a high accuracy over a small range of movement. The long-stroke module is arranged to move the short- stroke module relative to the projection system PS with a relatively low accuracy over a large range of movement. With the combination of the long-stroke module and the short-stroke module, the first positioner PM is able to move the mask support MT relative to the projection system PS with a high accuracy over a large range of movement. Similarly, the second positioner PW may comprise a long- stroke module and a short-stroke module. The short-stroke module is arranged to move the substrate support WT relative to the long-stroke module with a high accuracy over a small range of movement. The long-stroke module is arranged to move the short-stroke module relative to the projection system PS with a relatively low accuracy over a large range of movement. With the combination of the long-stroke module and the short-stroke module, the second positioner PW is able to move the substrate support WT relative to the projection system PS with a high accuracy over a large range of movement.

[00027] The first positioner PM and the second positioner PW each are provided with an actuator to move respectively the mask support MT and the substrate support WT. The actuator may be a linear actuator to provide a driving force along a single axis, for example the y-axis. Multiple linear actuators may be applied to provide driving forces along multiple axis. The actuator may be a planar actuator to provide a driving force along multiple axis. For example, the planar actuator may be arranged to move the substrate support WT in 6 degrees of freedom. The actuator may be an electro-magnetic actuator comprising at least one coil and at least one magnet. The actuator is arranged to move the at least one coil relative to the at least one magnet by applying an electrical current to the at least one coil. The actuator may be a moving-magnet type actuator, which has the at least one magnet coupled to the substrate support WT respectively to the mask support MT. The actuator may be a moving-coil type actuator which has the at least one coil coupled to the substrate support WT respectively to the mask support MT. The actuator may be a voice-coil actuator, a reluctance actuator, a Lorentz-actuator or a piezo-actuator, or any other suitable actuator. In an embodiment of the present invention, the first positioner PM and/or the second positioner PW includes one or more actuators or motors according to the present invention for displacing or positioning the mask support MT and/or the substrate support WT.

[00028] The lithographic apparatus LA comprises a position control system PCS as schematically depicted in Figure 3. The position control system PCS comprises a setpoint generator SP, a feedforward controller FF and a feedback controller FB. The position control system PCS provides a drive signal to the actuator ACT. The actuator ACT may be the actuator of the first positioner PM or the second positioner PW. The actuator ACT drives the plant P, which may comprise the substrate support WT or the mask support MT. An output of the plant P is a position quantity such as position or velocity or acceleration. The position quantity is measured with the position measurement system PMS. The position measurement system PMS generates a signal, which is a position signal representative of the position quantity of the plant P. The setpoint generator SP generates a signal, which is a reference signal representative of a desired position quantity of the plant P. For example, the reference signal represents a desired trajectory of the substrate support WT. A difference between the reference signal and the position signal forms an input for the feedback controller FB. Based on the input, the feedback controller FB provides at least part of the drive signal for the actuator ACT. The reference signal may form an input for the feedforward controller FF. Based on the input, the feedforward controller FF provides at least part of the drive signal for the actuator ACT. The feedforward FF may make use of information about dynamical characteristics of the plant P, such as mass, stiffness, resonance modes and eigenfrequencies.

[00029] The present invention relates to a superconducting article, in particular to a multi-layer superconductive article such as a superconductive tape. Such a superconductive tape can e.g. be used for manufacturing coils which can be applied in actuators or motors. Superconductive tapes are known in general and comprise several different layers.

[00030] Figure 4 schematically shows a build-up of a known multilayer superconductive tape. The multilayer superconductive tape 100 as shown comprises multiple layers that are stacked in a stacking direction SD as indicated. The multilayer superconductive tape 100 as shown comprises a substrate layer 110 which can e.g. be made from a non-magnetic material or alloy. The multilayer superconductive tape 100 further comprises a layer 120 of superconductive material, e.g. a (RE)BCO type material, whereby RE stands for a Rare Earth material such as Ytrium. The layer 120 of superconductive material may e.g. be applied by means of vapour deposition techniques or the like. In known arrangements, one or more buffer layers or cap layers are provided between the substrate layer 110 and the superconductive layer 120, the buffer layers or cap layers ensuring proper growth of the superconductive layer 120. The multilayer superconductive tape 100 further comprises an electrically stabilizing layer 130, e.g. made from Cu or any other suitable conducting material. In known arrangements, a silver contact layer and/or a soldering layer may be applied between the superconductive layer 120 and the stabilizing layer 130. Typically, the different layers of the multilayer superconductive tape 100 have substantially the same width W, the width W being defined as the dimension of the tape in a transverse direction TD, the transverse direction being a direction perpendicular to the longitudinal direction LD of the tape and perpendicular to the stacking direction SD. Superconductive tapes as e.g. shown in Figure 4 may e.g. be applied for winding coils which can e.g. be applied in electromagnetic motors or actuators.

[00031] In order to maintain in a superconductive state, the combination of current through the superconductive layer, the local magnetic field strength and the local temperature need to be within certain limits. In case, during operation, losses occur in the superconductive tape or coil, said losses need to be vacated, in order to ensure that the triple condition of current, local magnetic field strength and temperature remains satisfied. In order to enable the occurring losses to be removed, the superconductive tape is typically arranged to contact a coolant, e.g. liquid Nitrogen or liquid Helium, depending on the required operating temperature of the superconductive tape or coil. Figure 5 schematically shows a cross- sectional view of a superconductive coil 500 arranged inside an enclosure 510 provided with a coolant 520. Typically, the enclosure will include an inlet and an outlet for the coolant 520. In the embodiment as shown, the coil 500 comprises 8 concentric windings or turns 500.1 , 500.2 that are wound tightly together. In the embodiment as shown, each winding 500.1, 500.2 comprises multiple layers, as shown in the detailed view of winding 500.2. In particular, the windings may comprise, in a similar manner as the superconductive tape 100 shown in Figure 4, a substrate layer 500.21, a superconductive layer 500.22 and a stabilising layer 500.23. In order to cool the superconductive coil 500, heat exchange (from the coil 500 to the coolant 520) needs to take place via the surfaces of the coil 500 interfacing or contacting the coolant 520. In the embodiment as shown, any heat or losses thus need to be transferred via the outer surfaces of the coil windings 500.1, 500.2 that are in contact with the coolant 520, i.e. the outer surfaces 530.1-530.4 of the group of 8 concentric windings. The surfaces of the superconductive coil 500 that are in contact with the coolant 520 may e.g. be referred to as heat exchanging surfaces. In such embodiment, the performance of the superconductive coil 500 may be limited by the amount of heat or losses that can be removed via said outer surfaces 530.1-530.4. It has been proposed in literature to increase the heat exchanging surface of a superconductive coil by including a porous material layer or spacers between adjacent windings of the coil, in order to allow coolant to flow between adjacent windings. Such an arrangement however results in an increase in the size of the cross-section of the coil, in particular the coil width CW, when the same number of turns need to be accommodated. Such an arrangement would thus lead to a reduced current density per unit length along the width of the coil.

[00032] It is an objective of the present invention to provide alternative manners to increase the heat exchanging surface of a superconductive coil, so as to improve the cooling capabilities.

In an embodiment of the present invention there is provided a multilayer superconductive article extending in a longitudinal direction and comprising a substrate layer, a superconducting layer and a further layer, wherein the substrate layer or the further layer comprises one or more cooling taps or cooling fins or the like. Such cooling tabs or fins may extend both in the longitudinal direction and in a transverse direction, substantially perpendicular to the longitudinal direction.

[00033] By means of such cooling tabs or fins, the superconductive article may be cooled more effectively. In particular, the application of the cooling tabs or fins enables an increased heat exchanging surface with a coolant.

[00034] In an embodiment, at least part of the substrate layer or the further layer extend beyond a side surface of the superconductive layer.

[00035] In an embodiment, the further layer may have the function of a stabilizing layer. In accordance with such embodiment of the present invention, at least part of the substrate layer or the stabilizing layer extends beyond a side surface of the superconductor layer.

[00036] Such an embodiment is schematically shown in Figures 6 and 7.

[00037] Figure 6 schematically shows a plan view of a superconductive article 600, e.g. a tape, according to an embodiment of the present invention, whereas Figure 7 schematically shows a cross- sectional view of the article 600. The superconductive article 600 comprises a substrate layer 610, a superconductive layer 620 and a further layer 630, which can e.g. be a stabilizing layer. As can be seen, the layers 610, 620, 630 are stacked in the stacking direction SD. The layers 610, 620 and 630 of the superconductive article 600 extend both in the longitudinal direction LD and the transverse direction TD. Within the meaning of the present invention, length is used to denote a dimension of the article or a layer of the article in the longitudinal direction LD, width is used to denote a dimension of the article or a layer of the article in the transverse direction TD and thickness is used to denote a dimension of the article or a layer of the article in the stacking direction SD. Surfaces of the various layers as applied in the superconductive article according to the present invention which extend in both the longitudinal direction LD and the transverse direction TD are referred to as main surfaces, whereas surfaces of the various layers which extend in both the longitudinal direction LD and the stacking direction SD are referred to as side surfaces. In Figures 6 and 7, reference number 630.1 thus refers to a main surface of the further layer 630, reference number 630.2 refers to a side surface of the further layer 630 and reference number 620.2 refers to a side surface of the superconductive layer 620.

In accordance with an embodiment of the present invention, the substrate layer or the further layer comprises one or more cooling taps or cooling fins or the like. In the embodiment as shown, it can be seen that the width of the further layer 630 is larger than the width of the substrate layer 610 or the superconductive layer 620. As such, the further layer 630 extends somewhat, in the transverse direction TD, beyond the substrate layer 610 and the superconductive layer 620. In particular, the further layer 630 as applied in the superconductive article 600 extend beyond the side surface 620.2 of the superconductive layer. Phrased differently, a side surface 630.2 of the further layer is more remote from a plane of symmetry P of the superconductive layer 620 than a side surface 620.2 of the superconductive layer 620. By doing so, the heat exchanging surface of the superconductive article can be increased substantially.

In the embodiment as shown, the portion of the further layer 630 that extends beyond the substrate layer 610 and the superconductive layer 620 is denoted by reference number 632 in Figure 7. Said portion 632 may thus be considered as a cooling tab or cooling fin.

[00038] Providing a superconductive article with one or more cooling tabs or fins can be realised in various manners.

[00039] Figure 8 schematically shows cross-sectional views of various superconductive articles according to embodiments of the present invention which have been provided with a cooling tab. The cross-sectional views are in a plane substantially perpendicular to the longitudinal direction of the superconductive article, which can e.g. be a tape.

[00040] Figure 8 (a) schematically shows a cross-sectional view of an embodiment of a

superconductive article 800 comprising a substrate layer 810, a superconductive layer 820 and a further layer 830. The further layer may e.g. be a stabilizing layer, e.g. made from or comprising an electrical conductor such as Cu, Al, Ni or the like. The layers are stacked in a stacking direction SD and extend in the transverse direction TD. In the embodiment as shown, a right-side side surface 810.2 of the substrate layer 820 extends beyond the right-side side surfaces 820.2 and 830.2 of the superconductive layer 820 and the further layer 830. By doing so, the part of the substrate layer 810 that extends beyond the side surfaces 820.2 and 830.3, indicated by reference number 812 may serve as a cooling tab or cooling fin. In the embodiment as shown, the left-side side surfaces of the substrate layer 810, the superconductive layer 820 and the further layer 830 are substantially flush. Figure 8 (b) schematically shows a cross-sectional view of another embodiment of a superconductive article 900 comprising a substrate layer 910, a superconductive layer 920 and a further layer 930. In the embodiment as shown, cooling tabs are provided on both sides of the superconductive article 900. In particular, in the embodiment as shown, a right-side side surface 910.2 of the substrate layer 910 extends beyond the right-side side surfaces 920.2 and 930.2 of the superconductive layer 920 and the further layer 930 and a left-side side surface 910.4 of the substrate layer 910 extends beyond the left-side side surfaces 920.4 and 930.4 of the superconductive layer 920 and the further layer 930. By having cooling tabs or fins 912, 914 on both sides of the superconductive article 900, a further increase in the heat exchanging surface can be realised.

[00041] Rather than having a substrate layer or further layer with an increased width, relative to a width of the superconductive layer, one can also realise a cooling tab or fin by an asymmetrical stacking of the different layers of the superconductive article. Figure 8 (c) illustrates such an embodiment. Figure 8 (c) schematically shows a cross-sectional view of an embodiment of a superconductive article 1000 comprising a substrate layer 1010, a superconductive layer 1020 and a further layer 1030. In the embodiment as shown, the further layer 1030 is shifted towards the right, relative to the substrate layer 1010 and the superconductive layer 1020. By doing so, a cooling tab 1032 is realized. Regarding this embodiment, it can further be pointed out that, assuming a width of the further layer 1030 to be substantially the same as the width of the substrate layer 1010 and the superconductive layer 1020, there is a cooling tab generated on the left side as well. In particular, the portions of the substrate layer 1010 and the superconductive layer 1020 can be considered to extend beyond the side surface 1030.2 of the further layer 1030, thus generating an additional heat exchanging surface. In particular, when the superconductive article 1000 is applied as a magnet coil or actuator coil and emerged in an coolant such as liquid Nitrogen, heat can be exchanged via part of the main surface 1020.1 of the superconductive layer 1020. Regarding this cooling tab on the left which is formed by part of the superconductive layer and part of the substrate layer, it may be pointed out that it may be undesirable to have part of the superconductive layer serve as a heat exchanging surface that directly interacts with the coolant, since such an arrangement implies that a part of the superconductive layer is not bound by e.g. the further layer 1030. As a result of this, the part of the superconductive layer that extends beyond the side surface of the further layer 1030 may be subjected, during use, to forces being exerted on it and may deflect or deform. When the superconductive article 1000 is e.g. used to form a coil of a superconductive actuator, forces will be exerted on the current carrying conductors of the actuators, in particular on the superconductive layer of the actuator coil. Such forces may, in the embodiment of Figure 8 (c), cause a deformation of the left-side cooling tab.

[00042] In order to avoid or mitigate this, measures can be taken to avoid that the portion of the superconductive layer that extends beyond the side surface of the further layer carries a current during use. A cross-sectional view of such an embodiment is schematically shown in Figure 8 (d). Figure 8 (d) schematically shows a cross-sectional view of an embodiment of a superconductive article 1100 comprising a substrate layer 1110, a superconductive layer 1120 and a further layer 1130. In the embodiment as shown, the further layer 1130 is shifted towards the left, relative to the substrate layer 1110 and the superconductive layer 1120. In the embodiment as shown, the superconductive layer 1120 is assumed to comprise two parallel portions 1120.1, 1120.2.. By the shift of the further layer 1130, a cooling tab 1132 is realized on the left side and, assuming a width of the further layer 1130 to be substantially the same as the width of the substrate layer 1110 and the superconductive layer 1120.1,

1120.2, a cooling tab is generated on the right side as well. In the embodiment as shown, the parallel portions 1120.1, 1120.2 of the superconductive layer 1120 are assumed to be insulated from each other. This can e.g. be realised by cutting the superconductive layer 1120 along the longitudinal axis after the layer has been applied. By doing so, one can e.g. ensure that, during operation or normal use, the portion 1120.2 of the superconductive layer 1120.1, 1120.2 remains inactive, i.e. is not carrying any current. This can e.g. be realised by only connecting the portion 1120.1 of the superconductive layer 1120 to the power source, e.g. a voltage or current source. When the portion 1120.2 of the superconductive layer 1120 is not carrying any current, no forces will act on the cooling tab that is generated on the right.

[00043] As an alternative for disabling part of the superconductive layer 1120 as shown in Figure 8 (d), one can also, during the manufacturing, ensure that the superconductive layer only extends to surfaces that are covered by the further layer 1130, e.g. a stabilizing layer. Such an embodiment is schematically shown in Figure 8 (e). Figure 8 (e) schematically shows a cross-sectional view of an embodiment of a superconductive article 1200 comprising a substrate layer 1210, a superconductive layer 1220 and a further layer 1230. In the embodiment as shown, the further layer 1230 is shifted towards the left, relative to the substrate layer 1210 and the superconductive layer 1220. In the embodiment as shown, the width of the superconductive layer 1220 is smaller than the width of the substrate layer 1210, the superconductive layer 1220 being arranged in such manner that it is entirely covered by the further layer 1230 or entirely sandwiched between the substrate layer 1210 and the further layer 1230.

[00044] Figure 22 schematically shows a cross-sectional view of a superconductive article 2600, e.g. a tape, according to an embodiment of the present invention. The superconductive article 2600 comprises a substrate layer 2610, a conductive layer 2620 comprising a superconductive element 2620.1 and a conductive element 2620.2 (e.g. made from Cu or any other suitable conducting material) having substantially the same thickness as the superconductive element and a further layer 2630, which can e.g. be a stabilizing layer. As can be seen, the layers 2610, 2620, 2630 are stacked in the stacking direction SD. The layers 2610, 2620 and 2630 of the superconductive article 2600 extend both in the longitudinal direction LD and in the transverse direction TD. In Figure 22, reference number 2630.1 refers to a main surface of the further layer 2630, reference number 2630.2 refers to a side surface of the further layer 2630 and reference number 2620.12 refers to a side surface of the superconductive element 2620.1. In accordance with an embodiment of the present invention, the substrate layer or the further layer comprises one or more cooling taps or cooling fins or the like. In the embodiment as shown, it can be seen that the width of the further layer 2630 is larger than the width of the substrate layer 2610 or the conductive layer 2620. As such, the further layer 2630 extends somewhat, in the transverse direction TD, beyond the substrate layer 2610 and the conductive layer 2620. In particular, the further layer 2630 as applied in the superconductive article 2600 extends beyond the side surface 2620.2 of the superconductive layer. In the embodiment as shown, the portion of the further layer 2630 that extends beyond the substrate layer 2610 and the conductive layer 2620 is denoted by reference number 2632 in Figure 22. Said portion 2632 may thus be considered as a cooling tab or cooling fin. Figure 22 shows a gap 2620.3 in between

superconductive element 2620.1 and conductive element 2620.2, which is advantageous as it allows expansion of both elements even if there is a thermal expansion difference of these elements. If the further layer 2630 comprises thermally conductive material heat exchange between the superconductive element 2620.1 and the conductive element 2620.2 may occur. If the material of substrate layer 2610 is also thermally conductive cooling capabilities of a stack of multiple superconductive articles 2600 may be further increased.

[00045] The superconductive article according to the present invention, can be manufactured using similar processes and materials as applied for the manufacturing of known superconductive articles or tapes.

[00046] The substrate layer as applied in the superconductive article according to the present invention may e.g. be made from Hastelloy™ , Ni alloys, stainless steel, ferromagnetic or non ferromagnetic alloys. A main surface of the substrate layer may e.g. be electro polished to obtain the required low roughness and/or the required flatness. Typical thicknesses for the substrate layer may e.g. be in a range from 30 to 150 micrometer. Prior to the application of the superconductive layer, one or more buffer layers may be applied on the substrate layer in a superconductive article according to the present invention. As an example, the superconductive article according to the present invention may comprise an AI2O3 or Y2O3 layer, an LaMnCF layer, a MgO layer or similar layers. Such layers may e.g. be applied to provide a suitable texture for subsequently applying the superconductive layer.

[00047] The superconductive layer as applied may e.g. comprise a Rare Earth Barium Copper Oxide, (RE)BCO component. To apply the layer of (RE)BCO material, processes such as pulsed laser deposition or the like can be applied. Such materials may also be referred to 2G (second generation) superconductive materials.

[00048] The superconductive layer may be covered with a Silver coating whereupon a stabilizing layer, e.g. a Cu or Cu alloy is applied, e.g. soldered. [00049] In the embodiments of the superconductive article according to the invention as discussed above, the use of a superconductive layer is discussed. It can be pointed out that a superconductive article can be formed with multiple stacked superconductive layers.

It can further be pointed out that the superconductive article according to the invention may comprise one or more insulating layers or insulating materials. Examples of such insulation layers or materials may e.g. include polyimide (Kapton) tape wrapping, fiber glass and/or Kapton wrapping. Varnishes or Epoxy fillers (e.g. heat conductive fillers) can be applied, as well as sol-gels. T1O2 or a paint including colloidal graphite or AI2O3 can be used as well.

[00050] The superconductive article according to the present invention may advantageously be applied to form coils, coils which may be applied in superconductive magnets, actuators or motors. Such coils can e.g. be circular coils, racetrack coils, flat coils, non-flat coils, etc.

[00051] Figure 9 schematically shows a cross-sectional view of a superconductive coil according to the present invention, such coil being manufactured using a superconductive article, e.g. a tape-shaped superconductive article according to the present invention. Figure 9 schematically shows a cross-sectional view of a coil 1300 having 4 turns, each turn having a cross-section similar to the cross-section of the superconductive article 1200 as shown in Figure 8 (e), and thus comprising a substrate layer 1210, a superconductive layer 1220 and a further layer 1230. As can be seen, due to the displacement of the further layer 1230 relative to the substrate layer 1210, cooling tabs 1240 are available both on a top side of the coil and on a bottom side of the coil. In the embodiment as shown, the dotted lines 1310 schematically show an enclosure of the superconductive coil 1300. In the embodiment as shown, small gaps 1250 are provided between adjacent turns of the superconductive coil 1300, thus further increase the heat exchanging capacity of the coil. In an embodiment, the gaps 1250 may e.g. be generated by introducing spacers during the winding process of the coil. Said spacers may e.g. be made of a porous material to allow a close contact between the coil and the coolant applied within the enclosure.

Alternatively, the spacers can be made of a conductive material. It can be pointed out however that the turns of the coil may also be wound tightly together, i.e. without any gaps between them. In such arrangement, the coil 1300 will still have increased cooling capabilities, compared to a known coil such as coil 500 shown in Figure 5.

[00052] According to another aspect of the present invention, there is provided a superconductive coil which also provides improved cooling capabilities. Such a superconductive coil can be described as a superconducting coil comprising a plurality of windings made from a superconducting tape, whereby the superconducting coil further comprises one or more inserts arranged in a space between adjacent windings of the plurality of windings, the one or more inserts having a width that is larger than a width of the superconducting tape. [00053] Such inserts may e.g. be arranged between the adjacent windings during the winding process of the coil. In an embodiment, the one or more inserts may be a strip that is wound together with the superconductive tape. By providing inserts between adjacent windings, the inserts having a width that is larger than the superconductive tape, a heat transfer from the superconductive coil towards a coolant is facilitated. By providing inserts having a width that is larger than the superconductive tape, the inserts will extend beyond a side surface of the superconductive coil, whereby the portions that extend beyond the superconductive coil can be considered to serve or act as cooling tabs or fins. As such, in the superconductive coil according to the present invention, heat from the superconductive coil may be transferred, e.g. via conduction, to the one or more inserts, transferred to the one or more extremities of the inserts, i.e. the cooling tabs or fins, via conduction, and subsequently transferred to the coolant surrounding the superconductive coil and inserts. In an embodiment, the one or more inserts as applied in a superconductive coil according to the present invention are made from a thermally conductive material, e.g. Cu, Al, Ni or the like.

[00054] In an embodiment, the superconductive tape as applied to form the superconductive coil is a superconductive tape according to the present invention.

[00055] Figure 10 schematically shows a cross-sectional view of a superconductive coil 1400 according to the present invention, the coil being arranged in an enclosure 1425, said enclosure e.g. containing a coolant for maintaining the coil 1400 at a desired temperature. The superconductive coil 1400 comprises 4 turns or windings 1410 of a superconductive tape. In between adjacent windings 1410 of the coil 1400, inserts 1420 are provided, the inserts having a width Wi that is larger than a width W of the superconductive tape used to manufacture the coil 1400. In the embodiment as shown, the inserts 1420 extend beyond only one of the side surface 1410.2 of the coil 1410. In the embodiment as shown, a side surface of the one or more inserts is substantially flush with the other side surface of the coil, resulting in a substantially flat upper surface 1400.2 of the coil 1400. In an embodiment, the inserts 1420 may however extend beyond both side surfaces of the superconductive tape of which the coil is wound. In the embodiment as shown, the inserts do not entirely fill the gap between adjacent windings. By doing so, the heat exchanging surface of the superconductive coil 1400 can be further increased. Alternatively, the one or more inserts as applied may have a thickness substantially corresponding to a gap between the adjacent windings, thus entirely filling the gap between adjacent windings.

[00056] As mentioned, the inserts as applied may be a co-wound conductive tape or strip.

Alternatively, the inserts may be discrete strips inserted between adjacent windings. In an embodiment, the one or more inserts may e.g. be arranged along substantially straight portions of the plurality of windings. Note that the one or more inserts needs not be applied between each pair of adjacent windings. [00057] In an embodiment of the present invention, the one or more inserts are arranged in a meandering manner in between the windings. By doing so, the heat exchanging surface between the superconductive coil and the applied coolant can be further increased. Figure 11 schematically shows such an embodiment. Figure 11 schematically shows a cross-sectional view of a superconductive coil 1500 according to the present invention, the coil being arranged in an enclosure 1525, said enclosure e.g. containing a coolant for maintaining the superconductive coil 1500 at a desired temperature. The superconductive coil 1500 comprises 4 turns or windings 1510 of a superconductive tape. In between adjacent windings 1510 of the coil 1500, inserts 1520 are provided. In the embodiment as shown, the inserts 1520 have a U-shaped cross-section. Such a U-shaped cross-section is obtained by folding a substantially flat insert around a winding 1510 or a portion of a winding 1510. As can be seen, the applied inserts have a width Wi that is larger than a width W of the windings 1510 of the coil 1500. Due to the U- shape of the inserts, channels 1530 can be created between the inserts 1510 and side surfaces of the windings 1510 of the coil 1500, said channels may advantageously be applied by a coolant provided in the enclosure 1525.

[00058] Figure 12 shows another example of a superconductive coil 1600 according to the present invention, the coil being arranged in an enclosure 1625, said enclosure e.g. containing a coolant for maintaining the superconductive coil 1600 at a desired temperature. In the embodiment as shown, inserts 1620, 1622 are applied in a meandering manner in between windings 1610 of the coil 1600. In the embodiment as shown, the inserts 1620, 1622 are applied in a meandering manner in between the 4 windings 1610 of the coil 1600. The inserts may e.g. be provided along substantially straight portions of the coil windings. Such an arrangement can be realised by suitably folding strip-shaped elements 1620, 1622 during a winding process of the coil 1600.

[00059] In an embodiment, the superconductive tape as applied in the superconductive coil according to the present invention comprises a matrix of a superconductive material and a stabilizing material. Such a superconductive tape may be referred to as a multi-filament superconductive tape. Such tapes are also known as 1G (first generation) superconductive wires and tapes.

[00060] Figures 13 to 16 schematically show plan views of superconductive coils according to the present invention.

[00061] Figure 13 schematically shows a racetrack-shaped coil 1700 made from a superconductive article according to the present invention. In accordance with the present invention, the superconductive article comprises a layer 1710 that comprises one or more cooling tabs. In the embodiment as shown, the layer 1710 extends beyond a superconductive layer 1720 of the superconductive article, substantially along the entire length of the coil 1700. [00062] Figure 14 schematically shows a racetrack-shaped coil 1800 made from a superconducting tape 1810, the superconducting coil further comprises one or more inserts 1820 arranged in a space between adjacent windings of the plurality of windings of superconductive tape 1810, the one or more inserts 1820 having a width that is larger than a width of the superconducting tape 1810. In the embodiment as shown, the inserts 1820 are provided along substantially straight portions of the coil 1800. Note that the inserts need not have an enlarged width along their entire length; there may be portions where the cooling tabs are removed or where the inserts are interrupted. In the latter case, multiple spaced apart inserts may e.g. be applied along the straight portions of the coil 1800.

[00063] Figure 15 schematically shows a round or circular coil 1900 made from a superconductive article according to the present invention. In accordance with the present invention, the superconductive article comprises a layer 1910 that comprises one or more cooling tabs. In the embodiment as shown, the layer 1910 extends beyond a superconductive layer 1920 of the superconductive article, substantially along the entire length of the coil 1900.

[00064] Figure 16 schematically shows a round or circular coil 2000 made from a superconducting tape 2010, the superconducting coil further comprises an insert 2020 arranged in a space between adjacent windings of the plurality of windings, the insert having a width that is larger than a width of the superconducting tape 2010.

[00065] Figures 17 to 22 schematically show possible mounting arrangements of a superconductive coil according to the present invention. The mounting arrangements are applied to a circular coil 2100, which is similar to coil 2000 shown in Figure 16. As will be understood, similar mounting arrangements may be applied to other embodiments of coils according to the invention.

[00066] Figure 17 schematically shows a plan view of a coil 2100 according to the present invention, the coil 2100 being mounted to a core 2200.

[00067] Figure 18 schematically shows a plan view of the coil 2100 according to the present invention, the coil 2100 being mounted to a core 2210, the core 2210 being extended to a base 2300. In the embodiment as shown, a gap is present between the insert 2120 of the coil and the base 2300, thus allowing a coolant to access all sides of the coil 2100.

[00068] Figure 19 schematically shows a plan view of the coil 2100 according to the present invention, the coil 2100 being mounted to a core 2210, the core 2210 being extended to a base 2300, whereby the insert 2120 of the coil is configured to contact the base 2300. In such embodiment, the insert 2120 may e.g. be soldered to the base 2300. Cooling can be realised via conductive cooling towards the base and/or via cooling channels formed between the insert 2120, the base 2300 and the superconductive coil 2110. [00069] Figure 20 schematically shows a plan view of the coil 2100 according to the present invention, the coil 2100 being held at an outer circumference by a collet 2400, the collet 2400 being extended or mounted to a base 2300. In the embodiment as shown, a gap is present between the insert 2120 of the coil and the base 2300, thus allowing a coolant to access all sides of the coil 2100.

Alternatively, the insert 2120 can be configured to contact the base 2300, in a similar manner as shown in Figure 19.

[00070] Figure 21 schematically shows a plan view of the coil 2100 according to the present invention, the coil 2100 being held at an outer circumference by a collet 2400, the collet 2400 being extended or mounted to a base 2300. The mounting arrangement further comprises a cover 2500. In the embodiment as shown, the cover 2500 contacts a top surface of the coil 2100, similarly, the insert 2120 of the coil is configured to contact the base 2300. Alternatively, a gap can be present between cover 2500 and the top surface of the coil 2100 and/or between the insert 2120 of the coil and the base 2300.

[00071] In an embodiment, the superconductive coil according to the invention, e.g. a coil as shown in Figures 9 to 21, may be applied in a superconductive actuator or motor according to the invention. Such a superconductive actuator or motor can be considered an example of an electromagnetic actuator or motor. Such an electromagnetic actuator or motor typically operates due to interaction between a coil assembly and a magnet assembly, in particular due to an interaction between a current carrying coil of the coil assembly and a magnetic field generated by the magnet assembly. Superconductive coils may be applied in either a coil assembly of such an actuator or motor, or in a magnet assembly of such an actuator or motor, or in both.

[00072] A superconductive actuator or motor according to the invention may advantageously be applied in a lithographic apparatus according to the invention, for the positioning or displacement of a component or element of the lithographic apparatus. In particular, the superconductive actuator or motor may be applied for the positioning of a support such as a substrate support WT or a mask support MT as discussed above. In such embodiment, the present invention may thus provide a stage apparatus comprising an object support, e.g. to support a mask or a substrate, the stage apparatus further comprising one or more motors or actuators according to the present invention.

[00073] Although specific reference may be made in this text to the use of a lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications. Possible other applications include the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc.

[00074] Although specific reference may be made in this text to embodiments of the invention in the context of a lithographic apparatus, embodiments of the invention may be used in other apparatus. Embodiments of the invention may form part of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or processes an object such as a wafer (or other substrate) or mask (or other patterning device). These apparatus may be generally referred to as lithographic tools. Such a lithographic tool may use vacuum conditions or ambient (non-vacuum) conditions.

[00075] Although specific reference may have been made above to the use of embodiments of the invention in the context of optical lithography, it will be appreciated that the invention, where the context allows, is not limited to optical lithography and may be used in other applications, for example imprint lithography.

[00076] Where the context allows, embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented as instructions stored on a machine-readable medium, which may be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include read only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory devices; electrical, optical, acoustical or other forms of propagated signals (e.g. carrier waves, infrared signals, digital signals, etc.), and others. Further, firmware, software, routines, instructions may be described herein as performing certain actions.

However, it should be appreciated that such descriptions are merely for convenience and that such actions in fact result from computing devices, processors, controllers, or other devices executing the firmware, software, routines, instructions, etc. and in doing that may cause actuators or other devices to interact with the physical world.

[00077] While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. The descriptions above are intended to be illustrative, not limiting. Thus it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set out below. Other aspects of the invention are set-out as in the following numbered clauses.

1. A multilayer superconductive article extending in a longitudinal direction comprising:

a substrate layer extending in the longitudinal direction;

a superconductive layer extending in the longitudinal direction;

a further layer extending in the longitudinal direction;

wherein the substrate layer or the further layer comprises one or more cooling tabs extending in the longitudinal direction and in a transverse direction. 2. The multilayer superconductive article according to clause 1, wherein the one or more cooling tabs extend beyond a side surface of the superconductive layer.

3. The multilayer superconductive article according to clause 1 or 2, wherein the substrate layer comprises the one or more cooling tabs, a width of the substrate layer being larger than a width of the further layer.

4. The multilayer superconductive article according to clause 1 or 2, wherein the further layer

comprises the one or more cooling tabs, a width of the further layer being larger than a width of the substrate layer.

5. The multilayer superconductive article according to clause 1 or 2, wherein the substrate layer comprises the one or more cooling tabs, a side surface of the substrate layer extending beyond a side surface of the further layer in the transverse direction.

6. The multilayer superconductive article according to clause 1 or 2, wherein the further layer

comprises the one or more cooling tabs, a side surface of the further layer extending beyond a side surface of the substrate layer in the transverse direction.

7. The multilayer superconductive article according to any of the preceding clauses, wherein the further layer comprises a stabilizer layer.

8. The multilayer superconductive article according to any of the preceding clauses, wherein the substrate layer and the further layer are substantially planar, extending in the longitudinal direction and the transverse direction.

9. The multilayer superconductive article according to any of the preceding clauses, wherein each of the substrate layer, superconducting layer and further layer have a pair of substantially parallel main surfaces extending in the longitudinal direction and the transverse direction.

10. The multilayer superconductive article according to any of the preceding clauses, wherein the substrate layer, superconducting layer and further layer are stacked in a stacking direction substantially perpendicular to the longitudinal direction and the transverse direction. 11. The multilayer superconductive article according to any of the preceding clauses, further comprising at least one of

an insulation layer;

a cap layer, or

a buffer layer.

12. The multilayer superconductive article according to any of the preceding clauses, wherein the article is a tape.

13. A superconductive coil manufactured from the tape according to clause 11.

14. A superconductive coil comprising a plurality of windings made from a superconductive tape, the superconductive coil further comprises one or more inserts arranged in a space between adjacent windings of the plurality of windings, the one or more inserts having a width that is larger than a width of the superconductive tape.

15. The superconductive coil according to clause 14, wherein the superconductive tape comprises a 1G or 2G superconductive material.

16. The superconductive coil according to clause 14 or 15, wherein the superconductive tape is a tape according to clause 11.

17. The superconductive coil according to any of the clauses 14 to 16, wherein a side surface of the one or more inserts is substantially flush with a side surface of the tape.

18. The superconductive coil according to any of the clauses 14 to 17, wherein the one or more inserts are made from a thermally conductive material.

19. The superconductive coil according to any of the clauses 14 to 18, wherein the one or more inserts have a thickness substantially corresponding to a gap between the adjacent windings.

20. The superconductive coil according to any of the clauses 14 to 19, wherein the one or more inserts are arranged along substantially straight portions of the plurality of windings. 21. The superconductive coil according to any of the clauses 14 to 20, wherein the one or more inserts are arranged in a meandering manner in between the windings.

22. An actuator comprising a superconductive coil according to any of the clauses 13 to 21.

23. The actuator according to clause 22, wherein the actuator comprises a coil assembly and a magnet assembly, the coil assembly and the magnet assembly being configured to co-operate so as to generate a force or a torque, the superconductive coil being configured as part of the coil assembly or the magnet assembly.

24. A motor comprising a superconductive coil according to any of the clauses 13 to 21.

25. The motor according to clause 24, wherein the motor comprises a coil assembly and a magnet assembly, the coil assembly and the magnet assembly being configured to co-operate so as to generate a force or torque, the superconductive coil being configured as part of the coil assembly or the magnet assembly.

26. The motor according to clause 25, wherein the motor is configured as a one-dimensional linear motor or a two-dimensional planar motor.

27. A stage apparatus comprising an actuator according to clause 22 or clause 23 or a motor

according to any of the clauses 24 to 26.

28. The stage apparatus according to clause 27, wherein the stage apparatus comprises an object support for supporting an object, the actuator or motor being configured to displace or position the object support.

29. A lithographic apparatus comprising a stage apparatus according to clause 27 or 28.

30. The lithographic apparatus according to clause 29, wherein the stage apparatus is configured to support a mask or a substrate.