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Patent Searching and Data


Title:
MULTILAYER TRANSMISSION LINE PATH
Document Type and Number:
WIPO Patent Application WO/2019/189622
Kind Code:
A1
Abstract:
This multilayer transmission line path is provided with a multilayer substrate (2). The multilayer substrate (2) has a plurality of conductor layers (L1-L8) that are stacked in a given direction sandwiching a dielectric layer. Conductor layers (L3-L6) in an inner layer part (3) are provided with ground planes (11-14). The inner layer part (3) is provided with a conductor hole part (20). The conductor hole part (20) is provided so as to pass through the ground planes (11-14) in the inner layer part (3) in the given direction. A conductor part (21) that conducts electricity between the ground planes (11-14) is provided in the conductor hole part (20). A transmission line path (31) and a conversion part (33) are provided to a conductor layer (L1) in an outer layer part (4). The outer layer part (4) is provided with an inner conductor layer (L2) in addition to the outermost conductor layer (L1).

Inventors:
AOKI, Kazuhiro (1-1 Showa-cho, Kariya-sh, Aichi 61, 〒4488661, JP)
Application Number:
JP2019/013711
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
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Assignee:
DENSO CORPORATION (1-1 Showa-cho, Kariya-shi Aichi, 61, 〒4488661, JP)
International Classes:
H01P5/107; H01P3/08; H01P5/02; H05K3/46
Domestic Patent References:
WO2010061712A12010-06-03
WO2009041696A12009-04-02
Foreign References:
JP2011211170A2011-10-20
JP2002016408A2002-01-18
JP2007074422A2007-03-22
JP2015139042A2015-07-30
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL PATENT FIRM (Meishin Bldg, 20-19 Nishiki 1-chome, Naka-ku, Nagoya-sh, Aichi 03, 〒4600003, JP)
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