Title:
MULTILAYER TRANSMISSION LINE PLATE
Document Type and Number:
WIPO Patent Application WO/2017/122376
Kind Code:
A1
Abstract:
A multilayer transmission line plate having a pair of ground layers, a differential wiring layer disposed between the ground layer on one side and the ground layer on the other side among the pair of ground layers, a first insulation part disposed between the differential wiring layer and the ground layer one one side, and a second insulation part disposed between the differential wiring layer and the ground layer on the other side, the first insulation part having a resin layer, the first insulation part or the second insulation part having a fiber substrate layer containing a fiber substrate, and the thickness of the first insulation part being equal to or less than the thickness of the second insulation part.
Inventors:
TANIGAWA TAKAO (JP)
IRINO TETSUROU (JP)
KONDOU YUUSUKE (JP)
MIZUSHIMA ETSUO (JP)
FUKUDA TOMIO (JP)
NAGAI YUKI (JP)
IRINO TETSUROU (JP)
KONDOU YUUSUKE (JP)
MIZUSHIMA ETSUO (JP)
FUKUDA TOMIO (JP)
NAGAI YUKI (JP)
Application Number:
PCT/JP2016/071281
Publication Date:
July 20, 2017
Filing Date:
July 20, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K1/02; H01B7/08; H01B11/00; H01L23/12; H01P3/04; H05K3/46
Domestic Patent References:
| WO2013012053A1 | 2013-01-24 |
Foreign References:
| JP2007208473A | 2007-08-16 | |||
| JP2013083958A | 2013-05-09 | |||
| JP2006232952A | 2006-09-07 | |||
| JP2004099377A | 2004-04-02 |
Other References:
See also references of EP 3405010A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Download PDF: