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Title:
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/056340
Kind Code:
A1
Abstract:
Disclosed is a multilayer wiring board that has: a surface layer circuit board on which a surface layer circuit and an internal layer circuit are formed; internal layer circuit boards on which internal layer circuits are formed; non-penetrating vias, which penetrate the surface layer circuit board or the internal layer circuit boards, and which connect the surface layer circuit and the internal layer circuits to each other, or which connect the internal circuits to each other; and a penetrating through hole that penetrates in the whole board thickness direction. The internal layer circuits are disposed on the internal layer circuit boards at positions in the board thickness direction, said positions corresponding to the non-penetrating vias. A method for manufacturing the multilayer wiring board is also provided.

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Inventors:
YAMAGUCHI HIROYUKI (JP)
Application Number:
PCT/JP2015/083603
Publication Date:
April 06, 2017
Filing Date:
November 30, 2015
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K3/46
Foreign References:
JP2003174265A2003-06-20
JPH03180096A1991-08-06
JP2012074577A2012-04-12
JP2005116811A2005-04-28
Attorney, Agent or Firm:
MINAKAWA Kazuyasu (JP)
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