Title:
MULTILAYER WIRING BOARD, METHOD FOR PRODUCING MULTILAYER WIRING BOARD, POLISHER FOR MULTILAYER WIRING BOARD, AND METAL SHEET FOR PRODUCING WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2002/080639
Kind Code:
A1
Abstract:
A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring film-forming metal layer and bumps (2a) formed out of the bump-forming metal layer. The multilayer metal sheets are so stacked by repeating a stacking step in such a way that the bump-forming surface of one multilayer metal sheet faces to the wiring film of another multilayer metal sheet. A multilayer wiring board is polished by a polisher (11a) for a multilayer wiring board comprising a metal sheet holding means (13) for holding a metal sheet (1a), a blade holding means (25) for holding a blade (26) above the metal sheet, a height adjusting mechanism (20) for adjusting the height of the blade holding means, and a blade translating mechanism (15) for moving the blade holding means parallel to the surface of the metal sheet.
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Inventors:
IIJIMA TOMOO (JP)
KATO YOSHIRO (JP)
ODAIRA HIROSHI (JP)
OHSAWA MASAYUKI (JP)
KUROSAWA INETARO (JP)
SAKUMA KAZUO (JP)
ASANO TOSHIHIKO (JP)
ENDO KIMITAKA (JP)
KATO YOSHIRO (JP)
ODAIRA HIROSHI (JP)
OHSAWA MASAYUKI (JP)
KUROSAWA INETARO (JP)
SAKUMA KAZUO (JP)
ASANO TOSHIHIKO (JP)
ENDO KIMITAKA (JP)
Application Number:
PCT/JP2002/002982
Publication Date:
October 10, 2002
Filing Date:
March 27, 2002
Export Citation:
Assignee:
NORTH CORP (JP)
IIJIMA TOMOO (JP)
KATO YOSHIRO (JP)
ODAIRA HIROSHI (JP)
OHSAWA MASAYUKI (JP)
KUROSAWA INETARO (JP)
SAKUMA KAZUO (JP)
ASANO TOSHIHIKO (JP)
ENDO KIMITAKA (JP)
IIJIMA TOMOO (JP)
KATO YOSHIRO (JP)
ODAIRA HIROSHI (JP)
OHSAWA MASAYUKI (JP)
KUROSAWA INETARO (JP)
SAKUMA KAZUO (JP)
ASANO TOSHIHIKO (JP)
ENDO KIMITAKA (JP)
International Classes:
B24B1/00; B24B7/22; B24B37/04; H05K3/40; H05K3/46; H05K3/06; (IPC1-7): H05K3/46; H05K1/11; H05K3/40
Domestic Patent References:
WO2000005934A1 | 2000-02-03 |
Foreign References:
US5338900A | 1994-08-16 | |||
JP2001024340A | 2001-01-26 | |||
JP2001015922A | 2001-01-19 | |||
JPS6147641B2 | 1986-10-20 | |||
JPS55107948U | 1980-07-29 | |||
JP2000200967A | 2000-07-18 | |||
JPH10330983A | 1998-12-15 | |||
JPH0946041A | 1997-02-14 | |||
JPH11204943A | 1999-07-30 | |||
JPH08204332A | 1996-08-09 |
Other References:
See also references of EP 1377145A4
Attorney, Agent or Firm:
Misawa, Masayoshi (Nishi-Shinjuku 7-chome Shinjuku-ku, Tokyo, JP)
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