MULTILAYER WIRING BOARD, METHOD FOR PRODUCING MULTILAYER WIRING BOARD, POLISHER FOR MULTILAYER WIRING BOARD, AND METAL SHEET FOR PRODUCING WIRING BOARD

Title:

MULTILAYER WIRING BOARD, METHOD FOR PRODUCING MULTILAYER WIRING BOARD, POLISHER FOR MULTILAYER WIRING BOARD, AND METAL SHEET FOR PRODUCING WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2002/080639

Kind Code:

A1

Abstract:

A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring film-forming metal layer and bumps (2a) formed out of the bump-forming metal layer. The multilayer metal sheets are so stacked by repeating a stacking step in such a way that the bump-forming surface of one multilayer metal sheet faces to the wiring film of another multilayer metal sheet. A multilayer wiring board is polished by a polisher (11a) for a multilayer wiring board comprising a metal sheet holding means (13) for holding a metal sheet (1a), a blade holding means (25) for holding a blade (26) above the metal sheet, a height adjusting mechanism (20) for adjusting the height of the blade holding means, and a blade translating mechanism (15) for moving the blade holding means parallel to the surface of the metal sheet.

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Inventors:

IIJIMA TOMOO (JP)
KATO YOSHIRO (JP)
ODAIRA HIROSHI (JP)
OHSAWA MASAYUKI (JP)
KUROSAWA INETARO (JP)
SAKUMA KAZUO (JP)
ASANO TOSHIHIKO (JP)
ENDO KIMITAKA (JP)

Application Number:

PCT/JP2002/002982

Publication Date:

October 10, 2002

Filing Date:

March 27, 2002

Export Citation:

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Assignee:

NORTH CORP (JP)
IIJIMA TOMOO (JP)
KATO YOSHIRO (JP)
ODAIRA HIROSHI (JP)
OHSAWA MASAYUKI (JP)
KUROSAWA INETARO (JP)
SAKUMA KAZUO (JP)
ASANO TOSHIHIKO (JP)
ENDO KIMITAKA (JP)

International Classes:

B24B1/00; B24B7/22; B24B37/04; H05K3/40; H05K3/46; H05K3/06; (IPC1-7): H05K3/46; H05K1/11; H05K3/40

Domestic Patent References:

WO2000005934A1

2000-02-03

Foreign References:

US5338900A	1994-08-16
JP2001024340A	2001-01-26
JP2001015922A	2001-01-19
JPS6147641B2	1986-10-20
JPS55107948U	1980-07-29
JP2000200967A	2000-07-18
JPH10330983A	1998-12-15
JPH0946041A	1997-02-14
JPH11204943A	1999-07-30
JPH08204332A	1996-08-09

Other References: