Title:
MULTILAYER WIRING BOARD AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/043165
Kind Code:
A1
Abstract:
Multilayer wiring board (10) including different types of substrate layers.
The multilayer wiring board (10) comprises resin substrate layer (12) composed
of first insulating layer (24) of resin and first wiring layer (28) of conductive
material; ceramic substrate layer (14) composed of second insulating layer
(26) of ceramic and second wiring layer (32) of conductive material; mechanical
junction layer (18) for mechanical connection of the resin substrate layer and
ceramic substrate layer formed into a laminate; and electrical junction member
(16) for electrical connection of the resin substrate layer with the ceramic
substrate layer, which electrical junction member (16) passes through the mechanical
junction layer.
Inventors:
KOIDE MASATERU (JP)
ABE TOMOYUKI (JP)
ABE TOMOYUKI (JP)
Application Number:
PCT/JP2005/018684
Publication Date:
April 19, 2007
Filing Date:
October 11, 2005
Export Citation:
Assignee:
FUJITSU LTD (JP)
KOIDE MASATERU (JP)
ABE TOMOYUKI (JP)
KOIDE MASATERU (JP)
ABE TOMOYUKI (JP)
International Classes:
H05K3/46
Foreign References:
| JPH11274347A | 1999-10-08 | |||
| JPH09148743A | 1997-06-06 | |||
| JP2000216544A | 2000-08-04 | |||
| US5768108A | 1998-06-16 |
Attorney, Agent or Firm:
ITOH, Tadahiko (Yebisu Garden Place Tower 20-3, Ebisu 4-chom, Shibuya-ku Tokyo 32, JP)
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