Title:
MULTILAYER WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/090527
Kind Code:
A1
Abstract:
This multilayer wiring board is provided with: a first wiring board that is obtained by laminating a plurality of layers formed from a thermosetting resin and that has, formed between said layers in a state of being in contact with the layers, wiring layers; a second wiring board formed from ceramic; and a joint layer that is disposed between the reverse surface of the first wiring board and the obverse surface of the second wiring board and that joins the first wiring board and the second wiring board. At least a surface, of the joint layer, adjacent to the second wiring board is formed from a thermoplastic resin.
Inventors:
HASHIMOTO HIROHITO (JP)
NASU TAKAKUNI (JP)
SHIRAKI FUMIO (JP)
JIN GUANGZHU (JP)
NASU TAKAKUNI (JP)
SHIRAKI FUMIO (JP)
JIN GUANGZHU (JP)
Application Number:
PCT/JP2020/020311
Publication Date:
May 14, 2021
Filing Date:
May 22, 2020
Export Citation:
Assignee:
NGK SPARK PLUG CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2013031822A1 | 2013-03-07 |
Foreign References:
| JP2017037929A | 2017-02-16 | |||
| JP2015002262A | 2015-01-05 | |||
| JP2008218443A | 2008-09-18 | |||
| JP2017037929A | 2017-02-16 |
Other References:
See also references of EP 4057784A4
Attorney, Agent or Firm:
TANABE Junya et al. (JP)
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