MULTILAYER WIRING PLATE AND METHOD FOR FABRICATING SAME

Title:

MULTILAYER WIRING PLATE AND METHOD FOR FABRICATING SAME

Document Type and Number:

WIPO Patent Application WO/2014/119520

Kind Code:

A1

Abstract:

Provided is a multilayer wiring plate in which a coaxial wire having a signal line, an insulation coat, and an outer circumference conductor, is positioned in an inner layer, an insulation layer is positioned either further toward the inner layer side or further toward an outer layer side than this coaxial wire, a metal film circuit is positioned with this insulation layer interposed, and this metal film circuit is connected to the outer circumference conductor and the signal line of the coaxial wire, wherein the multilayer circuit substrate comprises: through holes (A) wherein a signal line connection part which connects the signal line of the coaxial wire and the metal film circuit passes through the insulation layer and the outer circumference conductor of the coaxial wire; a coaxial wire wherein the outer circumference conductor is removed within these through holes (A); a plug resin with which the interiors of the through holes (A) are filled; through holes (B) wherethrough this plug resin and the signal line of the coaxial wire pass; and a plating layer which is positioned upon the interior walls of these through holes (B). Also provided is a method for fabricating the multilayer wiring plate.

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Inventors:

YAMAGUCHI HIROYUKI (JP)
NAKAYAMA HAJIME (JP)
OGINO HARUO (JP)
KURIHARA SEIICHI (JP)

Application Number:

PCT/JP2014/051703

Publication Date:

August 07, 2014

Filing Date:

January 27, 2014

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

H05K3/46

Foreign References:

JPH04342191A	1992-11-27
JPH03165595A	1991-07-17
JPH05267845A	1993-10-15

Attorney, Agent or Firm:

MINAKAWA, Kazuyasu (JP)
Kazuyasu Minagawa (JP)

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