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Title:
MULTILAYER WIRING SUBSTRATE FOR PROBE CARDS, AND PROBE CARD PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2017/150232
Kind Code:
A1
Abstract:
A multilayer wiring substrate for probe cards, which has a laminate of resin layers, and which is suppressed in the production cost by reducing the occurrence of defects such as chipping by covering a ceramic substrate with a resin. A multilayer wiring substrate 3a is provided with: a core substrate 7; a resin part 8 that covers a lateral surface and a lower surface 12 of the core substrate 7; and a plurality of metal pins 11 that are provided within the resin part 8. The core substrate 7 comprises: a ceramic laminate part 9 that is arranged on the mother substrate side; and a resin laminate part 10 that is laminated on a main surface 13 of the ceramic laminate part 9, said main surface being on the reverse side of the mother substrate-side surface. The resin part 8 is provided with the plurality of metal pins 11, and is also provided with a through hole 22 that penetrates therethrough in the thickness direction of the resin part 8. The multilayer wiring substrate 3a is mounted on a mother substrate by inserting a fixation fitting 24 into the through hole 22.

Inventors:
TAKEMURA, Tadaji (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
KAWAKAMI, Hiromichi (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2017/006049
Publication Date:
September 08, 2017
Filing Date:
February 20, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H05K3/46; G01R1/073
Foreign References:
JP2009222597A2009-10-01
JP2011228427A2011-11-10
JP2004228103A2004-08-12
JP2000299559A2000-10-24
JP2007019198A2007-01-25
US20100117673A12010-05-13
Attorney, Agent or Firm:
YANASE, Yuji et al. (4F TAKAGI BLDG, 1-19 Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
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