Title:
MULTILAYER WIRING SUBSTRATE STRUCTURE EQUIPPED WITH POWER SOURCE AND GROUND PAIR LINES
Document Type and Number:
WIPO Patent Application WO/2011/111737
Kind Code:
A1
Abstract:
A multilayer wiring substrate which comprises a laminate (10) composed of an insulator layer and a patterned conductor layer, and which additionally comprises a first conductive line (1) for a power source and a second conductive line (2) for grounding which are arranged in parallel with each other in the laminate(10) and a first laminate film which is so arranged as to spread over the upper surface of the first conductive line (1) and the upper surface of the second conductive line (2) and is composed of a first insulating film (3) and a first conductive film (4) (a conductive or semiconductive film) laminated sequentially from the first and second conductive lines side.
Inventors:
OTSUKA KANJI (JP)
AKIYAMA YUTAKA (JP)
HASHIMOTO KAORU (JP)
KAWAGUCHI TOSHIYUKI (JP)
TAHARA KAZUTOKI (JP)
AKIYAMA YUTAKA (JP)
HASHIMOTO KAORU (JP)
KAWAGUCHI TOSHIYUKI (JP)
TAHARA KAZUTOKI (JP)
Application Number:
PCT/JP2011/055496
Publication Date:
September 15, 2011
Filing Date:
March 09, 2011
Export Citation:
Assignee:
MEISEI GAKUEN (JP)
SHINETSU POLYMER CO (JP)
NIHON MICRON CO LTD (JP)
OTSUKA KANJI (JP)
AKIYAMA YUTAKA (JP)
HASHIMOTO KAORU (JP)
KAWAGUCHI TOSHIYUKI (JP)
TAHARA KAZUTOKI (JP)
SHINETSU POLYMER CO (JP)
NIHON MICRON CO LTD (JP)
OTSUKA KANJI (JP)
AKIYAMA YUTAKA (JP)
HASHIMOTO KAORU (JP)
KAWAGUCHI TOSHIYUKI (JP)
TAHARA KAZUTOKI (JP)
International Classes:
H05K3/46; H05K1/02; H05K1/09
Foreign References:
| JPH11307894A | 1999-11-05 | |||
| JP2009283688A | 2009-12-03 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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Claims:
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