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Patent Searching and Data


Title:
MULTILAYERED STRUCTURE, VACUUM PACKAGING BAG AND VACUUM INSULATOR
Document Type and Number:
WIPO Patent Application WO/2021/039646
Kind Code:
A1
Abstract:
A multilayered structure provided, in this order, with a substrate (X), an inorganic vapor deposition layer (Y) and an overcoat layer (Z), wherein: the substrate (X) comprises a biaxially oriented polyvinyl alcohol resin film; the overcoat layer (Z) contains a modified polyvinyl alcohol (A) which has a vinyl alcohol unit (a) and a monomer unit (b) having a polar group other than the vinyl alcohol unit (a); and the thickness of the overcoat layer (Z) is 0.003-5μm, inclusive.

Inventors:
ISHIHARA HISASHI (JP)
Application Number:
PCT/JP2020/031678
Publication Date:
March 04, 2021
Filing Date:
August 21, 2020
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
B32B15/082; B65D81/38; F16L59/065
Domestic Patent References:
WO2019004324A12019-01-03
Foreign References:
JP2019064074A2019-04-25
JP2019104161A2019-06-27
JP2008056861A2008-03-13
JP2019002442A2019-01-10
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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