Title:
MULTILAYERED SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/114205
Kind Code:
A1
Abstract:
A multilayered substrate comprising a plurality of layers stacked in a stack vertical direction. The plurality of layers include a first spacer, a first ground conductor layer located above the first spacer, and a signal conductor layer overlapping the first ground conductor layer when viewed in the stack vertical direction, the signal conductor layer being located below the first spacer. The first spacer has a plurality of first through-holes penetrating through the first spacer in the stack vertical direction. The plurality of first through-holes are arranged along a first direction. A plurality of first through-holes that are adjacent to each other in the first direction have a uniform distance between the centers of gravity thereof. The first spacer has a plurality of sets of a plurality of first through-holes. The plurality of sets of a first through-holes are arranged along a second direction. When viewed from the stack vertical direction, a plurality of first through-holes that are adjacent to each other in the second direction have a uniform distance between the centers of gravity thereof. At least one of the first through-holes is a first hollow through-hole which is hollow, the first hollow through-hole overlapping the signal conductor layer when viewed from the stack vertical direction.
Inventors:
IKEMOTO NOBUO (JP)
KAWABE KENTARO (JP)
KAWABE KENTARO (JP)
Application Number:
PCT/JP2021/043729
Publication Date:
June 02, 2022
Filing Date:
November 30, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P3/08; H05K1/02
Domestic Patent References:
| WO2017130731A1 | 2017-08-03 |
Foreign References:
| JPH09298407A | 1997-11-18 | |||
| JP2012119786A | 2012-06-21 | |||
| JP2014216449A | 2014-11-17 | |||
| JPS57192022U | 1982-12-06 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
Download PDF: