MULTILAYERED SUBSTRATE

WIPO Patent Application WO/2011/018979

A1

Provided is a multilayered substrate that can maintain a curved state without causing variations in electrical properties. A main body (12) comprises a plurality of layered insulating sheets (22) that comprise a flexible material. A signal wire (32) extends inside the main body (12). A ground conductor (30) is provided inside the main body (12) to the +z side of the signal wire (32) and, in a planar view from the direction of the z-axis, overlaps the signal wire (32). Another ground conductor (34) is provided inside the main body (12) to the −z side of the signal wire (32) and, in a planar view from the direction of the z-axis, overlaps the signal wire (32). Due to plastic deformation of the ground conductors (30 and 34), the main body (12) maintains a curved state in which the signal wire (32) traces out an arc.

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JP3445511	INSULATING SUBSTRATE AND MANUFACTURE THEREOF AND SEMICONDUCTOR DEVICE
JP4418250	High frequency circuit module

KATO NOBORU (JP)
SASAKI JUN (JP)
ISHINO SATOSHI (JP)

PCT/JP2010/063308

February 17, 2011

August 05, 2010

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MURATA MANUFACTURING CO (JP)
KATO NOBORU (JP)
SASAKI JUN (JP)
ISHINO SATOSHI (JP)

H05K1/02; H05K3/46

JPH07106787A	1995-04-21
JPS5552860U	1980-04-09
JP2006080173A	2006-03-23
JP2003179317A	2003-06-27
JP2007049060A	2007-02-22
JPS61111595A	1986-05-29
JP2007134473A	2007-05-31
JP2006228922A	2006-08-31
JP2000138422A	2000-05-16
JP2002290034A	2002-10-04

MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)

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