MULTILAYERED SUBSTRATE

WIPO Patent Application WO/2021/210297

A1

An element according to the present invention has a structure in which a plurality of insulator layers, including a first insulator layer and a second insulator layer, are laminated in the vertical direction. The first insulator layer is disposed above the second insulator layer. A radiation conductor layer is provided on the upper surface of the first insulator layer. A first capacity formation section contains a first interlayer connection conductor penetrating, in the vertical direction, one or more insulator layers among the plurality of insulator layers. The first interlayer connection conductor electrically connects to the radiation conductor layer. The radiation conductor layer, a ground conductor, and the first capacity formation section function as a patch antenna. If the first interlayer connection conductor is electrically connected to the radiation conductor layer, the distance from the lower end of the first interlayer connection layer to the ground conductor in the vertical direction is shorter than the distance from the radiation conductor layer to the ground conductor in the vertical direction.

KAMADA KOJI (JP)
KOMAKI KUNIHIRO (JP)
IZAWA MASAHIRO (JP)
KOMURA RYO (JP)

PCT/JP2021/009016

October 21, 2021

March 08, 2021

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MURATA MANUFACTURING CO (JP)

H01Q13/08; H05K1/02; H05K3/46

WO2007069366A1

2007-06-21

JP2001111329A	2001-04-20
JP2008236362A	2008-10-02
JP2003332830A	2003-11-21
JP2010056718A	2010-03-11

KAEDE PATENT ATTORNEYS' OFFICE (JP)

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