Title:
MULTILAYERED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/238562
Kind Code:
A1
Abstract:
A second layered body is located in a positive direction of a Z-axis of a first layered body. The second layered body is fixed to the first layered body as a result of bonding a first insulating body layer and a second insulating body layer. Regions that are obtained by dividing the first layered body into three equal parts in the Z-axis direction are treated as a positive region, a middle region, and a negative region. At least one section of each of one or more positive-region first conducting body layers is located in the positive region. The entirety of each of one or more middle-region first conducting body layers is located in the middle region. The Z-axis direction thickness of at least one of the one or more positive-region first conducting body layers is greater than the respective Z-axis direction thicknesses of the one or more middle-region first conducting body layers.
Inventors:
IKEMOTO NOBUO (JP)
ICHIKAWA KEIICHI (JP)
KAWABE KENTARO (JP)
ICHIKAWA KEIICHI (JP)
KAWABE KENTARO (JP)
Application Number:
PCT/JP2023/017214
Publication Date:
December 14, 2023
Filing Date:
May 06, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H05K3/38
Domestic Patent References:
| WO2014115433A1 | 2014-07-31 |
Foreign References:
| JP2019021863A | 2019-02-07 | |||
| JP2002171036A | 2002-06-14 | |||
| JP2014207346A | 2014-10-30 | |||
| JP2006344828A | 2006-12-21 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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