Title:
MULTILAYERED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYERED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/123961
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a multilayered wiring board that is producible at low cost and a method for manufacturing the multilayered wiring board. To achieve this purpose, there are employed a multilayered wiring board, etc., characterized in that: a tape-form resin film with packaged sub-boards is used in which first to Nth sub-boards having components mounted thereon are interconnected by a resin film at prescribed intervals, the tape-form resin film with packaged sub-boards comprising, from one end toward the other end, circuits and openings for accommodating electronic components for when it is necessary to accommodate the electronic components projecting from the sub-board surfaces that are brought adjacent to each other when superposed together; and the first to Nth sub-boards are folded and laminated together, from the first sub-board at one end of the tape-form resin film with packaged sub-boards toward the Nth sub-board, while the electronic components projecting from the adjacent sub-board surfaces are accommodated in the openings for accommodating the electronic components.
Inventors:
KOIWA ICHIRO (JP)
Application Number:
PCT/JP2017/046415
Publication Date:
July 05, 2018
Filing Date:
December 25, 2017
Export Citation:
Assignee:
KANTO GAKUIN SCHOOL CORP (JP)
International Classes:
H05K3/46
Foreign References:
| JP2005506713A | 2005-03-03 | |||
| JP2007180421A | 2007-07-12 | |||
| JPS4638858B1 | ||||
| US20120011713A1 | 2012-01-19 | |||
| JP2006073684A | 2006-03-16 |
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (JP)
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