MULTILEVEL INTERCONNECTION SYSTEM

WIPO Patent Application WO/2010/122437

A3

A male connection component (120) for connection with a correspondingly confϊgured female connection component (140) having a recess (144) extending into a main surface (170) of a female Substrate (142) of the female connection component (140), wherein the female connection component (140) comprises a plurality of electrically conductive female contacts (146) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (170) of the female Substrate (142), the male connection component (120) comprising a male Substrate (102), a Protrusion (104) protruding from a main surface (160) of the male Substrate (102) and comprising a plurality of electrically conductive male contacts (106) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (160) of the male Substrate (102), wherein the male connection component (120) is adapted for connection with the female connection component (140) so that upon connection, each of the plurality of electrically conductive male contacts (106) is brought in contact with one of the plurality of electrically conductive female contacts (146) for providing electric contactation at different height levels, wherein the male Substrate (102) forms at least part of one of a chip, a chip package and a circuit board.

PISCHLER ERICH (AT)

PCT/IB2010/051328

May 19, 2011

March 26, 2010

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NXP BV (NL)
PISCHLER ERICH (AT)

H01L23/485; H01L23/498

JP2006060077A	2006-03-02
US20070235215A1	2007-10-11
JP2000252381A	2000-09-14
US20060097370A1	2006-05-11
EP0898311A2	1999-02-24
US20040007774A1	2004-01-15
US20040173894A1	2004-09-09

KROTT, Michel et al. (AE Eindhoven, NL)

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