Title:
MULTILEVEL LIGHT EMITTING LED SUBSTRATE AND PACKAGE, AND BULB
Document Type and Number:
WIPO Patent Application WO/2017/041709
Kind Code:
A1
Abstract:
A multilevel light emitting LED substrate and package, and a bulb, comprising multiple annular substrates disposed at intervals, wherein every two adjacent annular substrates among the multiple annular substrates are connected by using at least one connection part, and the connection part is stretched and shaped such that the multiple annular substrates are located in different planes to form a three-dimensional structure. By means of the multilevel light emitting LED substrate and package, and the bulb, a planar LED substrate and package can be processed to be a three-dimensional structure; the process is convenient, the structure is simple, and it is easy to set and control LED chips; moreover, the process efficiency is high, so that the LED package is not easily damaged in the process, and the production efficiency and yield are improved.
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Inventors:
GE TIEHAN (CN)
Application Number:
PCT/CN2016/098299
Publication Date:
March 16, 2017
Filing Date:
September 07, 2016
Export Citation:
Assignee:
GE TIEHAN (CN)
International Classes:
F21K9/20; H01L33/64; F21K9/232
Foreign References:
| CN203463969U | 2014-03-05 | |||
| CN204176377U | 2015-02-25 | |||
| CN204927353U | 2015-12-30 | |||
| CN205001877U | 2016-01-27 | |||
| CN105098050A | 2015-11-25 | |||
| CN205001884U | 2016-01-27 | |||
| CN205065341U | 2016-03-02 | |||
| CN203656627U | 2014-06-18 |
Other References:
See also references of EP 3349261A4
Attorney, Agent or Firm:
NINGBO TRANFAN TRADEMARK&PATENT OFFICE (CN)
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