MULTIPLE STACK DEPOSITION FOR EPITAXIAL LIFT OFF

Title:

MULTIPLE STACK DEPOSITION FOR EPITAXIAL LIFT OFF

Document Type and Number:

WIPO Patent Application WO/2010/077616

Kind Code:

A3

Abstract:

Embodiments of the invention are provided for a thin film stack containing a plurality of epitaxial stacks disposed on a substrate and a method for forming such a thin film stack. In one embodiment, the epitaxial stack contains a first sacrificial layer disposed over the substrate, a first epitaxial film disposed over the first sacrificial layer, a second sacrificial layer disposed over the first epitaxial film, and a second epitaxial film disposed over the second sacrificial layer. The thin film stack may further contain additional epitaxial films disposed over sacrificial layers. Generally, the epitaxial films contain gallium arsenide alloys and the sacrificial layers contain aluminum arsenide alloys. Methods provide the removal of the epitaxial films from the substrate by etching away the sacrificial layers during an epitaxial lift off (ELO) process. The epitaxial films are useful as photovoltaic cells, laser diodes, or other devices or materials.

Inventors:

HE GANG (US)
HEGEDUS ANDREAS (US)

Application Number:

PCT/US2009/067027

Publication Date:

August 26, 2010

Filing Date:

December 07, 2009

Export Citation:

Click for automatic bibliography generation Help

Assignee:

ALTA DEVICES INC (US)
HE GANG (US)
HEGEDUS ANDREAS (US)

International Classes:

H01L21/20; H01L21/306

Foreign References:

US20080299746A1	2008-12-04
US4846931A	1989-07-11
US5753134A	1998-05-19

Other References: