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Title:
MULTIPLE THERMAL CUTTING DEVICE AND MULTIPLE THERMAL CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/001242
Kind Code:
A1
Abstract:
A multiple thermal cutting device and a multiple thermal cutting method. The multiple thermal cutting device comprises both a laser head and a plasma torch controllable independently of each other for performing both laser beam machining and plasma machining. Both thermal cutting heads can be selectively used properly to reduce running cost. A large number of cutting lines for cutting out various products from plate materials can be classified into a laser beam cutting type and a plasma cutting type according to the length of a cutting line, whether the cutting line is applicable to the outer periphery of a product or a hole in the product, the size of the product or the hole, a requested working accuracy, and a plate thickness. The lines for the laser beam cutting type are used for cutting by the laser beam machining and the lines for the plasma cutting type are used for cutting by the plasma machining.

Inventors:
Yamaguchi, Yoshihiro c/o Komatsu Industries Corp. (Awazu Plant Fu 1, Kushimach, Komatsu-shi Ishikawa 65, 92309, JP)
Kabata, Tetsuya c/o Komatsu Industries Corp. (Awazu Plant Fu 1, Kushimach, Komatsu-shi Ishikawa 65, 92309, JP)
Kamada, Ikuo c/o Komatsu Industries Corp. (Awazu Plant Fu 1, Kushimach, Komatsu-shi Ishikawa 65, 92309, JP)
Application Number:
PCT/JP2005/011239
Publication Date:
January 05, 2006
Filing Date:
June 20, 2005
Export Citation:
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Assignee:
Komatsu Industries Corporation (Jikata 5, Yokaichi-machi Komatsu-shi, Ishikawa 25, 92309, JP)
Yamaguchi, Yoshihiro c/o Komatsu Industries Corp. (Awazu Plant Fu 1, Kushimach, Komatsu-shi Ishikawa 65, 92309, JP)
Kabata, Tetsuya c/o Komatsu Industries Corp. (Awazu Plant Fu 1, Kushimach, Komatsu-shi Ishikawa 65, 92309, JP)
Kamada, Ikuo c/o Komatsu Industries Corp. (Awazu Plant Fu 1, Kushimach, Komatsu-shi Ishikawa 65, 92309, JP)
International Classes:
B23K26/00; B23K10/00; B23K26/08; B23K26/38; B23K28/02; (IPC1-7): B23K26/00; B23K26/08; B23K26/38; B23K10/00; B23K28/02
Attorney, Agent or Firm:
Willfort International (Kanda Center Bldg, 5F 3-2, Kajicho 2-chom, Chiyoda-ku Tokyo, 101-0044, JP)
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