Title:
NITROGEN-CONTAINING Cu ALLOY FILM, MULTILAYER FILM, METHOD FOR PRODUCING NITROGEN-CONTAINING Cu ALLOY FILM OR MULTILAYER FILM, AND Cu ALLOY SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2016/158181
Kind Code:
A1
Abstract:
Provided is a nitrogen-containing Cu alloy film, which has high electrical conductivity and improved visibility, while having excellent wiring line processability, and which is useful, for example, as a low reflection wiring line. This nitrogen-containing Cu alloy film is characterized by containing at least one element X selected from among Ni and Al, with the balance made up of Cu and unavoidable impurities. This nitrogen-containing Cu alloy film is also characterized in that if the film is partially nitrided and has a thickness of 50 nm, the reflectance thereof at a wavelength of 650 nm is 45% or less and the optical absorptance thereof at a wavelength of 650 nm is 40% or more.
Inventors:
SHIDA YOKO
GOTO HIROSHI
KUGIMIYA TOSHIHIRO
GOTO HIROSHI
KUGIMIYA TOSHIHIRO
Application Number:
PCT/JP2016/056491
Publication Date:
October 06, 2016
Filing Date:
March 02, 2016
Export Citation:
Assignee:
KK KOBE SEIKO SHO(KOBE STEEL LTD ) (JP)
International Classes:
C23C14/06; B32B15/01; C23C14/14; C23C14/34
Domestic Patent References:
| WO2014035196A1 | 2014-03-06 |
Foreign References:
| KR20150029561A | 2015-03-18 | |||
| JP2010206062A | 2010-09-16 |
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)
Hisakazu Ueki (JP)
Download PDF: