NANO DISPERSION COPPER ALLOY HAVING HIGH AIRTIGHTNESS AND LOW FREE OXYGEN CONTENT, AND SHORT-PROCESS PREPARATION TECHNOLOGY

WIPO Patent Application WO/2020/155322

A1

A nano dispersion copper alloy having high airtightness and low free oxygen content, and a short-process preparation technology. The compositions of the alloy comprise Al2O3, Ca, and La. The preparation technology for the alloy comprises: preparing Cu-Al2O3 alloy powder by using an internal oxidation method, then mixing with Cu-Ca-La alloy powder, wrapping the mixed powder with a capsule under the protection of an argon atmosphere, performing rotary swaging subsequent to performing hot extrusion at the temperature of 900-920°C, evacuating the interior of the capsule to be less than or equal to 10-3Pa subsequent to performing rotary swaging, and sealing the capsule and placing in a nitrogen atmosphere with the temperature of 450-550°C and the pressure intensity of 40-60 Mpa for 3-5 hours. The prepared dispersion copper has the free oxygen content less than or equal to 15 ppm, high dimensional stability and good airtightness after hydrogen annealing, and a gas leakage rate less than or equal to 1.0×10-10 Pa m3/s, is applicable to industrial production, and can be used as the material of various sealing devices, such as an electronic vacuum shell sealing device and the high-voltage direct-current relay of a new energy vehicle.

LI ZHOU (CN)
QIU WENTING (CN)
XIAO ZHU (CN)
GONG SHEN (CN)

PCT/CN2019/078199

August 06, 2020

March 15, 2019

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UNIV CENTRAL SOUTH (CN)

C22C1/05; C22C1/10; C22C9/00; C22C32/00

CN104164587A	2014-11-26
CN101250639A	2008-08-27
CN101121974A	2008-02-13
CN101240387A	2008-08-13
CN101586198A	2009-11-25
EP0364295A2	1990-04-18
JPH06228681A	1994-08-16

JIAQUAN IP LAW FIRM (CN)

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