NCF FOR PRESSURE MOUNTING, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE USING SAME

WIPO Patent Application WO/2019/012892

A1

Provided is an NCF suitable for pressure-mounting. A pre-applied semiconductor sealing film for curing in a pressurized environment is characterized by containing (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and includes at least one of the structures represented by formulae 1 and 2, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000, and in that: the epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340; the component (B) is contained in an amount of 6 to 27 parts by mass per 100 parts by mass of the component (A); the component (C) is contained in an amount of 20 to 65 parts by mass per 100 parts by mass of total components present; the content ratio ((A):(D)) of the component (A) and component (D) is 99:1 to 65:35; the melt viscosity at 120ºC is 100 Pa·s or less; and the melt viscosity at 120ºC measured after heating at 260ºC or higher for 5 to 90 seconds is 200 Pa·s or less.

TOSAKA KENICHI (JP)
FUKUHARA YOSHIHIDE (JP)
SAITO HIROMI (JP)
HOTCHI TOYOKAZU (JP)
HOSHIYAMA MASAAKI (JP)

PCT/JP2018/022390

January 17, 2019

June 12, 2018

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NAMICS CORP (JP)

C08G59/50; C08K3/36; C08L63/00; C08L71/08; H01L21/60

WO2016148121A1

2016-09-22

JP2016113525A	2016-06-23
JP2006143775A	2006-06-08
US20130245161A1	2013-09-19
US6787606B1	2004-09-07
JP2011246596A	2011-12-08

IAT WORLD PATENT LAW FIRM (JP)

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