Title:
NEAR-INFRARED ABSORBENT COMPOSITION, NEAR-INFRARED CUTOFF FILTER USING SAME, METHOD FOR MANUFACTURING NEAR-INFRARED CUTOFF FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/017295
Kind Code:
A1
Abstract:
Provided is a near-infrared absorbent composition in which transmittance of visible light rays and reduction of transmittance post baking are suppressed even when the solid content ratio of copper complexes is increased, and which has excellent near-infrared shielding properties even in a thin film, and is capable of being applied. A near-infrared absorbent composition containing a copper complex, a polyfunctional polymerizable compound, and a solvent, wherein the solid content of the near-infrared absorbent composition is 35-90% by mass.
Inventors:
BAK SEONGMU (JP)
HITOMI SEIICHI (JP)
HITOMI SEIICHI (JP)
Application Number:
PCT/JP2013/068814
Publication Date:
January 30, 2014
Filing Date:
July 10, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G02B5/22; C09K3/00; C09B57/10
Domestic Patent References:
| WO2011071052A1 | 2011-06-16 |
Foreign References:
| JPH1152127A | 1999-02-26 | |||
| JP2012103340A | 2012-05-31 | |||
| JP2008268267A | 2008-11-06 | |||
| JP2010026074A | 2010-02-04 | |||
| JP2010222503A | 2010-10-07 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
Download PDF:
Previous Patent: ADHESIVE COMPOSITION, BONDING METHOD THEREOF, AND SEPARATION METHOD AFTER BONDING
Next Patent: FOREIGN-OBJECT REMOVAL MECHANISM
Next Patent: FOREIGN-OBJECT REMOVAL MECHANISM