NEAR-INFRARED ABSORBING COMPOSITION, NEAR-INFRARED CUT FILTER, METHOD OF MANUFACTURING NEAR-INFRARED CUT FILTER, SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND IMAGE DISPLAY DEVICE

WIPO Patent Application WO/2017/104735

A1

Provided are a near-infrared absorbing composition allowing for the manufacture of a cured film having excellent solvent resistance and heat shock resistance, a near-infrared cut filter, a method of manufacturing the near-infrared cut filter, a solid-state imaging device, a camera module, and an image display device. The near-infrared absorbing composition comprises a resin A which satisfies conditions a1, an infrared absorbing agent B, and a solvent D, and the near-infrared absorbing composition being such that, at least, either the resin A has a crosslinkable group, or included is a compound C which is a compound other than the resin A and has a crosslinkable group. Conditions a1: if the resin A does not have a crosslinkable group, the glass transition temperature of the resin A is 0 to 100°C as measured by differential scanning calorimetry; and if the resin A has a crosslinkable group, the glass transition temperature of the resin having a structure resulting from substitution, by hydrogen atoms, of the sites that form crosslinked bonds, from among the crosslinkable groups possessed by the resin A, is 0 to 100°C as measured by differential scanning calorimetry.

HITOMI SEIICHI (JP)
KAWASHIMA TAKASHI (JP)
ARIMURA KEISUKE (JP)
OKAWARA TAKAHIRO (JP)

PCT/JP2016/087338

June 22, 2017

December 15, 2016

Click for automatic bibliography generation  

FUJIFILM CORP (JP)

G02B5/22; C08K5/00; C08L33/10; C08L43/04; C08L101/02; H01L27/14

WO2008084653A1	2008-07-17
WO2008087964A1	2008-07-24
WO1999026951A1	1999-06-03

JP2009031747A

2009-02-12

SIKS & CO. (JP)

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