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Patent Searching and Data


Title:
NEGATIVE PHOTORESIST MATERIAL AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/113795
Kind Code:
A1
Abstract:
A negative photoresist material and an application thereof. The negative photoresist material contains a pyrocatechol group. The negative photoresist material is applied and cured on a surface of a silicon substrate (1) to form a negative photoresist (2). The surface of the silicon substrate (1) has a hydroxyl structure. The negative photoresist material contains a pyrocatechol group. A hydrogen bond structure is formed between a hydroxyl structure in the pyrocatechol group and the hydroxyl structure of the silicon substrate. A compound containing a pyrocatechol group is added into a negative photoresist material, so that the hydroxyl in the pyrocatechol group and the hydroxyl in the silicon substrate (1) form a hydrogen bond, thereby improving the adhesion between the negative photoresist (2) formed by the negative photoresist material and the silicon substrate (1).

Inventors:
LI YING (CN)
Application Number:
PCT/CN2019/072425
Publication Date:
June 11, 2020
Filing Date:
January 18, 2019
Export Citation:
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Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
G03F7/038; G03F7/004
Foreign References:
JP2004004528A2004-01-08
CN107501478A2017-12-22
CN108693713A2018-10-23
CN106691874A2017-05-24
CN106233202A2016-12-14
JP2011013588A2011-01-20
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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